- Full integration of tool temperature in the process parameters and bonding programms
All features of a Heavy Wire Bonder BJ959 with same footprint
- Improved wire guidance: short distance between bondhead and spool
- Optimized pattern recognition
- Automated bondtool change without wedge gauge
- Precisely programmable bondforce actuator
- Loop generator for individual loops
- Maintenance-free solid state joints
- Pre-setting of bondheads via EEPROM
- Hesse Assist Tools (option):
- E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
- Automated bondforce calibration; a load cell prevents operator error and ensures robust processes
- Innovative bondtool detection
- Wire spool detection
Flexibility
- Flexible use of the large working area, e.g. vacuum clamping of several
5″ x 7″ standard DCBs by vacuum workholder sixfold - Maximization of throughput by automation (two/more parallel lanes
- Safe operation: Laser class 1
- Two processes on one plattform: classic ultrasonic heavy wire
bonding and thermosonic heavy wire bonding
Quality
- Continuous real time monitoring of wire deformation, transducer current, and frequency, bond tool temperature within programmable control limits
- Process integrated Quality Control (PiQC): detection of further parameters, e.g. friction behavior, by additional sensor system for 100 % quality monitoring in real time (patented); as option
- Integrated, non-destructive pulltest
- Remote pull function on PiQC threshold value for optimized cycle time; > 99% savings in quality check compared with single NDPT (non destructive pull test)
Thermosonic Heavy Wire Bondhead
- Heavy wire bondhead with thermosonic function
- LSK (Backcut): Laser-heated bondtool tip with controlled laser
absorption - Temperature: Bondtool tip at 400-500 °C for interface at 150-200 °C
- Frequency: 60 kHz*; alternative frequencies on request
- Cutting methods: active, passive
- Fast local heat transport into wire and substrate
- No thermal effects on transducer
- Accurate laser setting due to pilot laser
- Inert gas noozle (e.g. nitrogen) prevents Cu oxidation during bonding process (option)
- Precisely controlled bondtool temperature
- Intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in minutes
- Wire clamp for loop shape control is standard on all bondheads; optionally equipped with non destructive pulltest
Wire
- Cu: 300 μm – 500 μm**
Laser
- IR fiber laser with power up to 130W
- Programmable temperature output
Loop form functions
- Reproducible loop geometry by wire guide appropriate for the material involved and moving wire buffer
- Constant wire length and loop height
- Mechanically demanding loop geometrics by parameterization and individual wire clamp application
- Individual loop shapes by configurable loop trajectory generator
Working area
| Bonder | X | Y | Z |
| LSB959 | 370 mm | 560 mm | 42 mm |
P-rotation: 440°
Footprint and weight
| Bonder | W x D x H [mm] | Weight |
| BJ959 | 805 x 1634 x 1912 | ca. 1300 kg |
| excl. attached parts like e.g. status lamp, control panel etc | ||
Media connectivity
- Power supply 230V AC
- Gigabit-Ethernet (TCP/IP)
- USB-Ports
- HDMI
- Compressed air (CDA clean, dry air)
- Vacuum
- Process gas
* exact range of frequencies on request
** other sizes on request
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