The Bondjet BJ653 serves the wire bonding processes of wedge-wedge as well as ball-wedge and can handle fine wire, heavy wire, ribbon. Particularly appropriate for the use in laboratories, in the development, for suppliers for validating their quality. BJ653 is ideal for product samples, pre-production prototypes, small volume production runs.
The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest demands for automotive and power electronics applications, handling heavy aluminum, copper and gold wire and ribbon on two specialized bondheads that can be changed out in minutes.
The Bondjets BJ955 and BJ959 of the new bonder generation are ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of substrates, chips and other materials. The systems can be used as a fully automatic machine or operated manually.
Bondjets BJ985 belongs to the new generation of wedge-wedge bonders with a large woorking area of 370 mm x 870 mm; developed for the fully automated processing of a wide range of large-sized substrates, chips, automotive applications (e.g. batteries) and other materials.