Fine Wire Bonder

High Speed Fully Automatic Fine Wire Bonder for Fine Wire Applications

Fine Wire Bonder (wedge-wedge and ball-wedge) meet the latest requirements in terms of technology and flexibility for components in the fields of HF and RF technology, COB, MCM, hybrids, optoelectronics and automotive electronics.

Outstanding features are: large working areas, maximum bonding speeds and highest axis accuracy paired with inline quality monitoring and multi-track automation solutions.

Bondjet BJ855 – Bondjet BJ885

Fine wire bonder with large working areas up to 370 mm x 870 m; ideal for single or multi-track automation

Bondjet BJ653

Interchangeable bondheads for fine and heavy wire; ideal for use in laboratories, in the development, for prototypes or small series