New England IMAPS

Visit us on May 12th in Boxborough

International Microwave Symposium

Visit us June 23rd - 25th in Los Angeles


Visit us at booth E3379

Semicon West

Visit us July 21st - 23rd in San Francisco

SEMICON Taiwan 2020

Visit us at booth L0524

IMAPS International Symposium

Visit us October 6th - 7th in San Diego

Award: "Best Innovation Award 2019" by Infineon

Hesse GmbH was awarded with the "Best Innovation Award" by Infineon on November 26, 2019 during the Global Supplier Day 2019. With this innovation prize, Infineon honors the successful, technical-scientific cooperation with Hesse Mechatronics.…

Wire Bonding: Profitable Small Scale Production with the High End Technology of Mass Production

The market of wire bonder can be divided into two segments: On one hand, the segment of high precision and fast production machines, on the other hand manual machines with an open working area. The differences in price, speed and integrated…
Battery Bonding Purdue

Wire Bonding Batteries for Formula1 EV Race Car

Purdue University, School of Mechanical EngineeringThe newly uploaded video on shows the wire bonding of the Purdue Electric Racing (PER) Batteries with a Hesse Mechatronics BJ959 Heavy Wire Bonder.The…