Semicon West - Hesse GmbH

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- Fine Wire Bonding
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- Thermosonic Wire Bonding
  - Bondjet LSB959
- Ultrasonic Welding
  - Smart Welder SW1085
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  - PiQC
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Company
Applications & Markets
Customer Solutions
Products
- Fine Wire Bonding
- Heavy Wire Bonding
- Thermosonic Wire Bonding
  - Bondjet LSB959
- Ultrasonic Welding
  - Smart Welder SW1085
- Special Features
  - Software
  - E-Box
  - PiQC
- Automation
News & Events
Contact
- Sales
- Service

Semicon West
July 11^th – 13^th 2023

Booth 1557
San Francisco, CA

Hesse GmbH Headquarters

Hesse GmbH
Lise-Meitner-Str. 5
D-33104 Paderborn

+49 5251 1560-0
+49 5251 1560-290

info@hesse-mechatronics.com

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