About us

Hesse GmbH was founded in 1995 and is based in Paderborn. Hesse new locationThe main expertise of Hesse GmbH is the development, manufacturing and marketing of fully automated machines for the assembly and connection technology together with standard or product specific automation solutions.

Hesse GmbH is one of the world’s leading producers of fully automated Wedge-Wedge Bonders, software for monitoring ultrasonic-bond-processes, ultrasonic Flip-Chip Bonders as well as customized tools and machines.

All relevant industrial companies engaged in assembly lean production wire bonderand connection technology (semiconductor manufacturers, HF/RF, automotive, medical etc.) are among the worldwide customers of Hesse GmbH. Optimum local support for our customers, especially in the important markets such as Asia and America, is ensured by subsidiaries in Hong Kong, USA and Japan with their own Sales and Service. Furthermore, we have partner companies and co-operations in over 30 countries.

The core competencies of the company are mechatronic systems, ultrasonic technology, control engineering and in particular the detailed knowledge of the processes and physical effects relevant in ultrasonic bonding technology. In order to maintain and expand technological leadership, we conduct intensive research and development in all aforementioned areas. There are international co-operations with universities and research institutes. Development goals include simple and wear-free constructions with highly integrated functionality and the integration of intelligent systems for achieving fault-free processes such as the patented process integrated quality control (PiQC) which records and evaluates quality-relevant parameters in real time.

Current Series Machines:

  • Bondjet BJ653: Bonder for manual or automatic bonding Fine Wire Bondhead
    (Wedge-Wedge and Ball-Wedge)
  • Bondjet BJ820: Fully Automatic Fine Wire Wedge-Wedge Bonder for 12,5 – 75 µm (Al, Au, Cu)
  • Bondjet BJ855: High Speed Fully Automatic Fine Wire Bonder
    (Wedge-Wedge and Ball-Wedge)
  • Bondjet BJ931: Fully Automatic Dual-Head Leadframe Wedge-Wedge Bonder for heavy wire, fine wire and ribbon (Al, AlCu, Cu)
  • Bondjet BJ935/939-BJ955/959: Fully Automatic Heavy Wire Wedge-Wedge Bonder for heavy wire and ribbon (Al, AlCu, Cu)
  • Bondjet BJ980: Fully Automatic Heavy Wire Wedge-Wedge Bonder especially for large-sized substrates like solar and battery applications
  • Bondjet BJ985: Fully Automatic Heavy Wire Wedge Bonder with a large working area

Process Support, Development & Consulting:

We support you in developing and implementing your individual process requirements (e.g. sample bonding, pre-production prototype, design validation builds, small series production, module production, process optimization).

Sustainability Policy

We are sincere in our social responsibility. Please read more in the following PDF.