Heavy Wire Bonder Bondjet BJ931

Bondjet BJ931

Dual-Head Leadframe Wedge Wire Bonder

The wire bonder Bondjet BJ931 is an ultrasonic wedge wire bonder developed especially for maxtrix leadframe applications. The application of two bondheads enables to bond two different wire sizes as well as a combination of wire and ribbon.

The fully automatic dual-head leadframe wedge wire bonder Bondjet BJ931 meets the latest technology and flexibility demands for automotive and power electronics applications; handling heavy aluminum, copper wire and ribbon on two specialized bondheads that can be exchanged.

Your benefits:

  • Robust, clean design
  • Low maintenance requirements
  • User-friendly software
  • Service support functions
  • Industry-leading PiQC™ process monitoring system

Advanced features and process advantages

  • Precisely programmable bondforce actuator
  • Wear-free components with Piezo technology
  • Maintenance-free solid state joints
  • Integrated, non destructive pulltest for wire and ribbon
  • Automated bondforce calibration
  • Pattern recognition time: 6 ms – 8 ms (search region: 512 × 512 pixels, pattern: 64 × 64 pixels)
  • Rapid image capture with new digital image processing and flash light illumination
  • E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
BJ931_heavy wire bondhead

Heavy Wire Bondhead for wire bonder BJ931

Central wedge bonder control system

  • A central 23″ touch panel is used to monitor and control the bonder and indexing system
  • Metal keypad and robust trackball for industrial use
  • User-friendly calibration wizard and automatic update of calibration data at bondhead change on all available bondheads


  • Highest UPH due to linear motors for bonder and indexer


  • Continuous real time monitoring of wire deformation, transducer current and frequency within programmable control limits
  • Process integrated Quality Control PiQC: detection of further parameters, e.g. friction behavior, by additional sensor system for 100 % quality monitoring in real time (patented); as option
  • Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % save on equipment
  • Inline pull modules for non-destructive pulltest with no influence on process time

Interchangeable bondheads for wire bonder Bondjet BJ931

  • The wire bonder Bondjet BJ931 supports heavy wire and ribbon bondheads for aluminum, copper and AlCu
  • An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
  • Wire clamp for loop shape control is standard on all heavy wire bondheads, optionally equipped with non-destructive pulltest

Product Clamping for wire bonder BJ931

Working area

  • X: 100 mm, Y: 90 mm, Z: 42 mm
  • P: 440°

Mechatronic bondhead

  • HBK (Frontcut, Backcut)
  • RBK Ribbon (Frontcut)
  • RBK Copper (Frontcut, Backcut)
    Frequency: 60 kHz*; alternative frequencies on request

Cutting methods

  • active, passive, air cut (for frontcut)


  • Al, Cu, AlCu: 50 μm – 600 μm** (2 mil – 24 mil)


  • Al, Cu, AlCu: 250 μm x 25 μm up to 2000 μm x 400 μm** (Cu: 200 μm)
    (10 mil x 1 mil up to 80 mil x 16 mil)


  • Digital ultrasonic generator with PLL (Phase Locked Loop),
    internal frequency resolution <1 Hz
  • Programmable ultrasonic power output

Footprint and weight

  • 1550 – 1725 mm x 1273 mm x 1885 mm (W x D x H, excl. light tower)
  • Weight: approx. 1400 kg

High speed leadframe indexer

  • Strip dimensions : 100 mm – 280 mm length, 15 mm – 90 mm width, max. 3.0 mm down-set
  • Substrate types: SOIC, SO8, SOL8, SOT, SOT23, SC70, TO220, powerQFN, QFN, DPAK, DFN, DSO, COB, multi-lead SOP, matrix L/F, flatboat, programmable pitch etc.
  • Index time: 100 ms for typical TO 220 device (includes clamping)
  • Magazine size: 115 mm – 285 mm length, 20 mm – 100 mm width, 50 mm – 200 mm height

* exact range of frequencies on request
**depending on application and wire