Heavy Wire Bonder Bondjet BJ931
Dual-Head Leadframe Wedge Bonder
The Bondjet BJ931 is an ultrasonic wedge bonder developed especially for maxtrix leadframe applications. The application of two bondheads enables to bond two different wire sizes as well as a combination of wire and ribbon.
The fully automatic dual-head leadframe wedge bonder Bondjet BJ931 meets the latest technology and flexibility demands for automotive and power electronics applications; handling heavy aluminum, copper wire and ribbon on two specialized bondheads that can be exchanged.
- Robust, clean design
- Low maintenance requirements
- User-friendly software
- Service support functions
- Industry-leading PiQC™ process monitoring system