Heavy Wire Bonder Bondjet BJ955/959

Bondjet BJ955/959

Fully Automatic Heavy Wire Wedge Bonder

Wire bonder Bondjets BJ955 and BJ959 belong to the new generation of ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips and other materials. The systems can be used as a fully automatic machine or operated manually. Hesse offers the only available solution on the market of handling wires from 50 μm up to 600 μm** with only one bondhead.
Wire bonder Bondjet BJ955/959 are characterized by several new features:

  • Optimized pattern recognition
  • Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, …)
  • Hesse Assist Tools: load cell, bondtool and wire spool detection, tool calibration without wedge gauge for operator independency

Outstanding features are high speed and the largest wire bonding area. A change from aluminium to copper can be realized within minutes. The Hesse GmbH, as technology leader, has designed the only heavy wire bondhead with a non destructive pulltest and a unique transducer integrated sensor for 100 % quality monitoring in real time. Advanced features available on the wire bonder Bondjet BJ955 and BJ959 are designed to meet your present and future requirements and greatly enhance productivity. In addition to a standard configuration Hesse offers automation concepts individually adapted for every application.

Advanced features and process advantages

  • 50 μm – 600 μm** bondhead for Al, Cu, AlCu (2 mil – 24 mil)
  • Improved wire handling: short distance between bondhead and spool
  • Optimized pattern recognition: image capture with new digital image processing and flash
  • Hesse Assist Tools (option):
    • E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
    • Automated bondforce calibration; a load cell prevents operating error and ensures robust processes
    • Innovative bondtool detection
    • Wire spool detection
  • Automated bondtool calibration without wedge gauge
  • Precisely programmable bondforce actuator
  • Loop generator for individual loops
  • Wear-free components with Piezo technology
  • Maintenance-free solid state joints
  • Pre-setting of bondheads via EEPROM
BJ955-heavy wire bondhead

Heavy Wire Bondhead

Flexibility

  • Working area:
    • BJ955: 305 mm x 410 mm
    • BJ959: 370 mm x 560 mm
  • Flexible use of the large working area, e.g. vacuum clamping of several 5″ x 7″ standard DCBs
  • Maximization of throughput by automation (two/more parallel lanes

Quality

  • Continuous real time monitoring of wire deformation, transducer current and frequency within programmable control limits
  • Process integrated Quality Control PiQC: detection of further parameters, e.g. friction behavior, by additional sensor system for 100 % quality monitoring in real time (patented); as option
  • Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % save on equipment
  • Integrated, non destructive pulltest for wire and ribbon

Heavy wire bondheads for wire bonder Bondjet BJ955/959

  • Heavy wire and ribbon bondheads for Al, Cu and AlCu
  • An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
  • Wire clamp for loop shape control is standard on all bondheads; optionally equipped with non destructive pulltest
BJ955-959-ribbon-bondhead-1

Bondhead for Ribbon

Working area

  • BJ955: X: 305 mm; Y: 410 mm; Z: 42 mm
  • BJ959: X: 370 mm; Y: 560 mm; Z: 42 mm
  • P-rotation: 440°

Mechatronic bondhead

  • HBK (Frontcut, Backcut)
  • RBK Ribbon (Frontcut)
  • RBK Copper (Frontcut, Backcut)
    Frequenz: 60 kHz*; alternative Frequenzen auf Anfrage

Cutting methods

  • active, passive, air cut (for frontcut)

Wire

  • Al, Cu, AlCu: 50 μm – 600 μm**  (2 mil – 24 mil)

Ribbon

  • Al, Cu, AlCu: 250 μm x 25 μm bis 2000 μm x 400 μm** (Cu: 200 μm)
    (10 mil x 1 mil up to 80 mil x 16 mil)

Ultrasonic

  • Digital ultrasonic generator with PLL (Phase Locked Loop),
    internal frequency resolution <1 Hz
  • Programmable ultrasonic power output

Footprint and weight

  • BJ955: 740 mm x 1484 mm x 1912 mm, appr. 1150 kg
  • BJ959: 805 mm x 1634 mm x 1912 mm, appr. 1300 kg

Various loop form functions

  • Reproducible loop geometry by wire guide appropriate for the material involved and moving wire buffer
  • Constant wire length and loop height
  • Mechanically demanding loop geometrics by parameterization and individual wire clamp application
  • Individual loop shapes by configurable loop trajectory generator

* exact range of frequencies on request
**depending on application and wire