Wire Bonder Bondjet BJ653

Bondjet BJ653

Bonder for all Bonding Methods
(Heavy Wire, Fine Wire, Wedge-Wedge and Ball-Wedge)

The Bondjet BJ653, with its changeable bondheads, serves the wire bonding processes of wedge-wedge as well as ball-wedge and can handle fine wire, heavy wire and ribbon.

The operating methods from manual to automatic bonding is particularly appropriate for the use in laboratories, in the development and for suppliers for validating their product quality. BJ653 is ideal for product samples, pre-production prototypes or small volume production runs in proven and reliable Hesse quality.

The Bondjet BJ653 is part of the new bonder generation and offers the same handling regarding operation and look & feel as the fully automatic machines of Hesse. It is characterized by an open workspace, which achieves the same process result as in a fully automated production wire bonder. The Bondjet BJ653 has a lower throughput than the other Bondjets but is the avenue to fully automatic wire bonding.

The available bondheads for the BJ653 are identical to the bondheads for the Hesse production machines. This enables a targeted preparation of the production process on the Bondjet BJ653.

Benefits and Features

Advanced features and process advantages

  • Bondheads for all common wire materials
  • Wear-free components with piezo technology
  • Maintenance-free flexure hinges
  • Working area: X: 100 mm; Y: 90 mm ; Z: 50 mm
  • Intelligent bondhead connecting system with integrated memory storing all calibration data: bondheads are interchangeable within a few minutes
  • Optimized pattern recognition
  • Use of all common wire spools
  • Loop generator for customized loops
  • Integrated, non destructive pulltest for wire and ribbon (HBK, RBK)
  • Continuous, real time monitoring of wire deformation, transducer current and frequency within programmable control limits
  • Machine mobility by mounted rollers; as an option
BJ653-heavy wire bondhead-2

Heavy Wire Bondhead (Al)

Heavy Wire Bondheads for BJ653

Heavy Wire Wedge-Wedge Bondheads

  • Heavy wire and ribbon bondheads for aluminum, copper and AlCu:
    • HBK (Frontcut, Backcut)
    • RBK Ribbon (Frontcut)
    • RBK Copper (Frontcut, Backcut)
  • Frequency: 60 kHz*; alternative frequencies available on request
  • Wire Al, Cu, AlCu: 50 μm – 600 μm
    (2 mil – 24 mil)**
  • Ribbon Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm
    (Cu: 200 µm) (10 mil x 1 mil up to 80 mil x 16 mil)**
  • Cutting methods:
    • Active Cutting: repeatable, precise, programmable cutting depth
    • Air Cut: No impact on surface, e.g. for highly sensitive chips because of „touch-free“ cutting
    • Passive Cutting
  • Integrated, non destructive pulltest
  • Process integrated Quality Control PiQC: detection of further parameters, e.g. friction behavior, by additional sensor system for 100 % quality monitoring in real time (patented); available as an option
BJ653-Ribbon bondhead

Bondhead for Ribbon

Heavy Wire Loop Design

  • Reproducible loop geometrics by wire guide appropriate for the material (e.g. pulling wire buffer)
  • Loop form functions: constant wire length, constant loop height, individual loop shapes
  • Mechanically demanding loop geometrics by parameterization and individual wire clamp application
BJ653-HBK10-50 mü

Heavy Wire Bondhead 50 µm

Fine Wire Bondheads for BJ653

Fine Wire Wedge-Wedge Bondheads

  • Bondhead 45° and 90° (deep access)
  • Frequency: 100 kHz*; alternative frequencies available on request
  • Wire Al, Au: 12.5 μm – 75 μm (0.5 mil – 3 mil)**
    Cu: 17.5 μm – 50 μm (0.7 mil – 2 mil)**
  • Ribbon: Al, Au: 35 μm x 6 μm up to 250 μm x 25 μm
    (1.4 mil x 0.25 mil up to 10 mil x 1 mil)**
  • High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
  • Precise bondforce control (static and dynamic)
  • Process integrated Quality Control PiQC: detection of further parameters, e.g. friction behavior, by additional sensor system for 100 % quality monitoring in real time (patented); available as an option

Fine Wire Wedge-Wedge Loop Design

  • Loop form functions: constant wire length, constant loop height, individual loop shapes
  • Fine pitch: 40 µm in-line, 25 µm staggered/dual-line (depending on wire and loop)
  • Freely programmable wire feed, tail length, tear stroke and opening gap of wire clamp

Ball-Wedge Bondhead

  • Thermosonic ball-wedge bondhead
  • Frequency: 120 kHz*
    Option: Dual-Frequency 120/60 kHz*
  • Wire: Au 17.5 µm – 50 µm (0.7 mil – 2 mil)**
  • 11/19 mm capillaries
  • Ultrasonic in preferred direction by bondhead rotation

Technical Data

  • Open working area BJ653: X: 100 mm; Y: 115 mm; Z: 42 mm
  • P-rotation: 440°
  • Digital ultrasonic generator with PLL (Phase Locked Loop), internal frequency resolution <1 Hz; programmable ultrasonic power output
  • Windows® Embedded operating system
  • Height of operator desk: 730 mm
  • Footprint: 700 mm x 1020 mm x 1409 mm (W x D x H, excl. monitor and light tower)
  • Weight: approx. 330 kg, depending on configuration
BJ653-Ball-wedge-product-slider

Ball-Wedge Bondhead

* exact range of frequencies on request
**depending on application and wire