Benefits and Features
Advanced features and process advantages
- Bondheads for all common wire materials
- Wear-free components with piezo technology
- Maintenance-free flexure hinges
- Working area: X: 100 mm; Y: 150 mm ; Z: 42 mm
- Intelligent bondhead connecting system with integrated memory storing all calibration data: bondheads are interchangeable within a few minutes
- Optimized pattern recognition
- Use of all common wire spools
- Loop generator for customized loops
- Integrated, non destructive pulltest for wire and ribbon (HBK, RBK)
- Continuous, real time monitoring of wire deformation, transducer current and frequency within programmable control limits
- Machine mobility by mounted rollers; as an option

Heavy Wire Bondhead (Al)
Heavy Wire Bondheads for wire bonder Bondjet BJ653
Heavy Wire Wedge-Wedge Bondheads
- Heavy wire and ribbon bondheads for aluminum, copper and AlCu:
- HBK (Frontcut, Backcut); frequency: 60 kHz*
- RBK Ribbon (Frontcut); frequency: 57 kHz*
- RBK Copper (Frontcut, Backcut); frequency: 57 kHz*
alternative frequencies available on request
- Wire Al, Cu, AlCu: 50 μm – 600 μm
(2 mil – 24 mil)** - Ribbon Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm
(Cu: 200 µm) (10 mil x 1 mil up to 80 mil x 16 mil)** - Cutting methods:
- Active Cutting: repeatable, precise, programmable cutting depth
- Air Cut: No impact on surface, e.g. for highly sensitive chips because of „touch-free“ cutting
- Passive Cutting
- Integrated, non destructive pulltest
- Process integrated Quality Control PiQC: detection of further parameters, e.g. friction behavior, by additional sensor system for 100 % quality monitoring in real time (patented); available as an option

Bondhead for Ribbon
Heavy Wire Loop Design
- Reproducible loop geometrics by wire guide appropriate for the material (e.g. pulling wire buffer)
- Loop form functions: constant wire length, constant loop height, individual loop shapes
- Mechanically demanding loop geometrics by parameterization and individual wire clamp application

Heavy Wire Bondhead 50 µm
Fine Wire Bondheads for wire bonder Bondjet BJ653
Fine Wire Wedge-Wedge Bondheads
- Bondhead 45° and 90° (deep access)
- Frequency: 100 kHz*; alternative frequencies available on request
- Wire Al, Au: 12.5 μm – 75 μm (0.5 mil – 3 mil)**
Cu: 17.5 μm – 50 μm (0.7 mil – 2 mil)** - Ribbon: Al, Au: 35 μm x 6 μm up to 250 μm x 25 μm
(1.4 mil x 0.25 mil up to 10 mil x 1 mil)** - High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
- Precise bondforce control (static and dynamic)
- Process integrated Quality Control PiQC: detection of further parameters, e.g. friction behavior, by additional sensor system for 100 % quality monitoring in real time (patented); available as an option
Fine Wire Wedge-Wedge Loop Design
- Loop form functions: constant wire length, constant loop height, individual loop shapes
- Fine pitch: 40 µm in-line, 25 µm staggered/dual-line (depending on wire and loop)
- Freely programmable wire feed, tail length, tear stroke and opening gap of wire clamp
Ball-Wedge Bondhead
- Thermosonic ball-wedge bondhead
- Frequency: 120 kHz*
Option: Dual-Frequency 120/60 kHz* - Wire: Au 17.5 µm – 50 µm (0.7 mil – 2 mil)**
- 11/19 mm capillaries
- Ultrasonic in preferred direction by bondhead rotation
Technical Data
- Open working area BJ653: X: 100 mm; Y: 115 mm; Z: 42 mm
- P-rotation: 440°
- Digital ultrasonic generator with PLL (Phase Locked Loop), internal frequency resolution <1 Hz; programmable ultrasonic power output
- Windows® Embedded operating system
- Height of operator desk: 730 mm
- Footprint: 700 mm x 1020 mm x 1409 mm (W x D x H, excl. monitor and light tower)
- Weight: approx. 330 kg, depending on configuration

Ball-Wedge Bondhead
* exact range of frequencies on request
**depending on application and wire
Video