Wire Bonder Bondjet BJ653

Advanced features and process advantages

• Bondheads for all common wire materials
• Wear-free components with piezo technology
• Maintenance-free flexure hinges
• Working area: X: 100 mm; Y: 150 mm ; Z: 42 mm
• Intelligent bondhead connecting system with integrated memory storing all calibration data: bondheads are interchangeable within a few minutes
• Optimized pattern recognition
• Use of all common wire spools
• Loop generator for customized loops
• Integrated, non destructive pulltest for wire and ribbon (HBK, RBK)
• Continuous, real time monitoring of wire deformation, transducer current and frequency within programmable control limits
• Machine mobility by mounted rollers; as an option

Heavy Wire Bondheads for wire bonder Bondjet BJ653

Heavy Wire Wedge-Wedge Bondheads

• Heavy wire and ribbon bondheads for aluminum, copper and AlCu:
  • HBK (Frontcut, Backcut); frequency: 60 kHz*
  • RBK Ribbon (Frontcut); frequency: 57 kHz*
  • RBK Copper (Frontcut, Backcut); frequency: 57 kHz*
    alternative frequencies available on request
• Wire Al, Cu, AlCu: 50 μm – 600 μm
  (2 mil – 24 mil)**
• Ribbon Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm
  (Cu: 200 µm) (10 mil x 1 mil up to 80 mil x 16 mil)**
• Cutting methods:
  • Active Cutting: repeatable, precise, programmable cutting depth
  • Air Cut: No impact on surface, e.g. for highly sensitive chips because of „touch-free“ cutting
  • Passive Cutting
• Integrated, non destructive pulltest
• Process integrated Quality Control PiQC: detection of further parameters, e.g. friction behavior, by additional sensor system for 100 % quality monitoring in real time (patented); available as an option

Heavy Wire Loop Design

• Reproducible loop geometrics by wire guide appropriate for the material (e.g. pulling wire buffer)
• Loop form functions: constant wire length, constant loop height, individual loop shapes
• Mechanically demanding loop geometrics by parameterization and individual wire clamp application

Fine Wire Bondheads for wire bonder Bondjet BJ653

Fine Wire Wedge-Wedge Bondheads

• Bondhead 45° and 90° (deep access)
• Frequency: 100 kHz*; alternative frequencies available on request
• Wire Al, Au: 12.5 μm – 75 μm (0.5 mil – 3 mil)**
  Cu: 17.5 μm – 50 μm (0.7 mil – 2 mil)**
• Ribbon: Al, Au: 35 μm x 6 μm up to 250 μm x 25 μm
  (1.4 mil x 0.25 mil up to 10 mil x 1 mil)**
• High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
• Precise bondforce control (static and dynamic)
• Process integrated Quality Control PiQC: detection of further parameters, e.g. friction behavior, by additional sensor system for 100 % quality monitoring in real time (patented); available as an option

Fine Wire Wedge-Wedge Loop Design

• Loop form functions: constant wire length, constant loop height, individual loop shapes
• Fine pitch: 40 µm in-line, 25 µm staggered/dual-line (depending on wire and loop)
• Freely programmable wire feed, tail length, tear stroke and opening gap of wire clamp

Ball-Wedge Bondhead

• Thermosonic ball-wedge bondhead
• Frequency: 120 kHz*
  Option: Dual-Frequency 120/60 kHz*
• Wire: Au 17.5 µm – 50 µm (0.7 mil – 2 mil)**
• 11/19 mm capillaries
• Ultrasonic in preferred direction by bondhead rotation