- 50 μm – 600 μm** bondhead for Al, Cu, AlCu (2 mil – 24 mil)
- Large working areas up to 370 mm x 870 mm
- High drive through in the Bondjet BJ985
- Improved wire handling: short distance between bondhead and spool
- Optimized pattern recognition: image capture with new digital imageprocessing and flash
- Hesse Assist Tools (option):
- E-Box: visualization solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
- Automated bondforce calibration; a load cell prevents operating error and ensures robust processes
- Innovative bondtool detection
- Wire spool detection
- Automated bondtool calibration without wedge gauge
- Precisely programmable bondforce actuator
- Loop generator for individualized loops
- Wear-free components with Piezo technology
- Maintenance-free solid state joints
- Pre-setting of bondheads via EEPROM
Automotive Module
Flexibility
- Flexible use of the large working area, e.g. vacuum clamping of several 5″ x 7″ standard DCBs
Maximization of throughput by automation (two/more parallel lanes)
Quality
- Continuous, real time monitoring of wire deformation, transducer current and frequency within programmable control limits
- Process integrated Quality Control PiQC: detection of further parameters, e.g. friction behavior, by additional sensor system for 100 % quality monitoring in real time (patented); as option
- Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % save on equipment
Integrated, non destructive pulltest for wire and ribbon
Mechatronic bondheads
Heavy Wire Bondhead
- Heavy wire and ribbon bondheads for Al, Cu and AlCu:
- HBK (Frontcut, Backcut); Frequency: 60 kHz*
- RBK Ribbon (Frontcut); Frequency: 57 kHz*
- RBK Copper (Frontcut, Backcut); Frequency: 57 kHz*
alternative frequencies available on request
- Cutting methods: active, passive, air cut (for frontcut)
- Digital ultrasonic generator with PLL (Phase Locked Loop),
internal frequency resolution <1 Hz; programmable ultrasonic power output - An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
- Wire clamp for loop shape control is standard on all bondheads;
optionally equipped with non destructive pulltest
Wire
- Al, Cu, AlCu: 50 μm – 600 μm**
Ribbon
- Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm**
(Cu: 200 µm)
Despooling station:
- Standard: up to 100 m wire/ribbon
- Improved version: > 100 m wire/ribbon;
please contact us for this
Loop form functions
- Reproducible loop geometry by wire guide appropriate for the
material involved and moving wire buffer - Constant wire length and loop height
- Mechanically demanding loop geometrics by parameterization and individual wire clamp application
- Individual loop shapes by configurable loop trajectory generator
Working area
| Bonder | X | Y | Z |
| BJ955 | 305 mm | 410 mm | 42 mm |
| BJ959 | 370 mm | 560 mm | 42 mm |
| BJ985 | 370 mm | 870 mm | 42 mm |
P-rotation: 440°
Footprint and weight
| Bonder | W x D x H [mm] | Weight |
| BJ955 | 740 x 1484 x 1912 | ca. 1150 kg |
| BJ959 | 805 x 1634 x 1912 | ca. 1300 kg |
| BJ985 | 880 x 1780 x 1912 | ca. 1800 kg |
| excl. attached parts like e.g. control panel, status lamp | ||
Media connectivity
- Power supply 230V AC
- Gigabit-Ethernet (TCP/IP)
- USB-Ports
- HDMI
- Compressed air (CDA clean, dry air)
- Vacuum
* exact range of frequencies on request
**depending on application and wire
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