Bondjet BJ955 / BJ959 / BJ985 – Fully Automatic Heavy Wire Wedge Bonder
Bondjet BJ955/959 and Bondjet BJ985 belong to the new generation of ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips, automotive applications (e.g. batteries) and other puposes.
The systems can be used as a fully automatic machine or operated manually. Hesse offers the only available solution on the market of handling wires from 50 μm up to 60 μm** with only one bondhead.
The Heavy Wire Bonder are characterized by several features:
- Optimized pattern recognition (PR)
- Software features for the growing demand of connectivity andindustry 4.0 (e.g. Hesse Bonder Network, remote control of PR,improved MES integration, …)
- Hesse Assist Tools: load cell, bondtool and wire spool detection, tool calibration without wedge gauge for operator independency
Outstanding features are high speed and the large working areas. A bondhead change from aluminium to copper can be realized within minutes. Hesse GmbH, as technology leader, has designed the only heavy wire bondhead with a non destructive pulltest and a unique transducer integrated sensor for 100 % quality monitoring in real time. In addition to a standard configuration Hesse offers automation concepts individually
- 50 μm – 600 μm** bondhead for Al, Cu, AlCu (2 mil – 24 mil)
- Large working areas up to 370 mm x 870 mm
- High drive through in the Bondjet BJ985
- Improved wire handling: short distance between bondhead and spool
- Optimized pattern recognition: image capture with new digital imageprocessing and flash
- Hesse Assist Tools (option):
- E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
- Automated bondforce calibration; a load cell prevents operating error and ensures robust processes
- Innovative bondtool detection
- Wire spool detection
- Automated bondtool calibration without wedge gauge
- Precisely programmable bondforce actuator
- Loop generator for individualized loops
- Wear-free components with Piezo technology
- Maintenance-free solid state joints
- Pre-setting of bondheads via EEPROM
Flexibility
- Flexible use of the large working area, e.g. vacuum clamping of several 5″ x 7″ standard DCBs
Maximization of throughput by automation (two/more parallel lanes)
Quality
- Continuous, real time monitoring of wire deformation, transducer current and frequency within programmable control limits
- Process integrated Quality Control PiQC: detection of further parameters, e.g. friction behavior, by additional sensor system for 100 % quality monitoring in real time (patented); as option
- Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % save on equipment
Integrated, non destructive pulltest for wire and ribbon
Mechatronic bondheads
- Heavy wire and ribbon bondheads for Al, Cu and AlCu:
- HBK (Frontcut, Backcut); Frequency: 60 kHz*
- RBK Ribbon (Frontcut); Frequency: 57 kHz*
- RBK Copper (Frontcut, Backcut); Frequency: 57 kHz*
alternative frequencies available on request
- Cutting methods: active, passive, air cut (for frontcut)
- Digital ultrasonic generator with PLL (Phase Locked Loop),
internal frequency resolution <1 Hz; programmable ultrasonic power output - An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
- Wire clamp for loop shape control is standard on all bondheads;
optionally equipped with non destructive pulltest
Wire
- Al, Cu, AlCu: 50 μm – 600 μm**
Ribbon
- Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm**
(Cu: 200 µm)
Loop form functions
- Reproducible loop geometry by wire guide appropriate for the
material involved and moving wire buffer - Constant wire length and loop height
- Mechanically demanding loop geometrics by parameterization and individual wire clamp application
- Individual loop shapes by configurable loop trajectory generator
Working area
Bonder | X | Y | Z |
BJ955 | 305 mm | 410 mm | 42 mm |
BJ959 | 370 mm | 560 mm | 42 mm |
BJ985 | 370 mm | 870 mm | 42 mm |
P-rotation: 440°
Footprint and weight
Bonder | W x D x H [mm] | Weight |
BJ955 | 740 x 1484 x 1912 | ca. 1150 kg |
BJ959 | 805 x 1634 x 1912 | ca. 1300 kg |
BJ985 | 880 x 1780 x 1912 | ca. 1800 kg |
excl. attached parts like e.g. control panel, status lamp |
Media connectivity
- Power supply 230V AC
- Gigabit-Ethernet (TCP/IP)
- USB-Ports
- HDMI
- Compressed air (CDA clean, dry air)
- Vacuum
* exact range of frequencies on request
**depending on application and wire
Download Brochure
Please complete the request form using the button and enter your name and business e-mail address. A download link will be sent to you after verification.
PiQC: Process integrated Quality Control
100 % Quality monitoring in real-time
Software Options
For the growing demand of connectivity and industry 4.0
Automation
Standard components or individually adapted solutions
Hesse GmbH Headquarters
Hesse GmbH
Lise-Meitner-Str. 5
D-33104 Paderborn
+49 5251 1560-0
info@hesse-mechatronics.com
Copyright © Hesse GmbH – The Bonding Experts.
Lise-Meitner-Str. 5
D-33104 Paderborn
+49 5251 1560-0
info@hesse-mechatronics.com
Copyright © Hesse GmbH – The Bonding Experts.