Ultrasonic Wire Bonder

for all wire sizes & applications!

Why Hesse?

Ultrasonic Wire Bonder for highest demands

  • Bonding speed
    Profit of the fastest wiring in the industry.

  • Automation
    Individual automation concepts for every application.

  • Process support & service
    Proof of concept, process development, design validation builds & consulting.

  • Precision
    Highest axis accuracy in the market.

  • Worldwide customer service
    Our technical service supports you - in every country.

  • Training
    Machinery and operator training – inhouse & at your facility.

  • PiQC quality control tool
    Process integrated Quality Control System –worldwide unique.

  • Spare part handling
    Fast and reliable spare parts delivery due to efficient logistics.

  • Bonding service
    Sample bonding, production of prototypes & small series.

Markets & Solutions

Ultrasonic Wire Bonding technology for your semiconductor industry

Hesse Service Hotline 

Service Hotline

Do you have questions according

to wire bonding?

We will be pleased to help you!



+49 5251 1560-333
service@hesse-mechatronics.com
Hesse process support

Process Support & Service

Please contact us for sample bonding, proof of concept, process-evaluation an/or production of prototypes or small series?


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