Wissenschaftliche Veröffentlichungen

Wir forschen und arbeiten kontinuierlich an der (Weiter-)Entwicklung bestehender und neuer Verfahren der Aufbau- und Verbindungstechnik und an Maschinen für den effizienten und zuverlässigen industriellen Einsatz dieser Verfahren. Aus dieser Arbeit sind in den vergangenen Jahren zahlreiche Veröffentlichungen entstanden:

2019

Intelligente Herstellung zuverlässiger Kupferbondverbindungen. Springer, 2019.

Sextro, W.; Brökelmann, M. (Hrsg.)

[online]


Process advantages of thermosonic wedge-wedge bonding using dosed tool heating.

Unger, A.; Hunstig, M.; Brökelmann, M.; Hesse, H. J.

Proceedings of 52nd Int. Sympsoium in Microelectronics (IMAPS), Boston, MA, USA, October 1-3, 2019 . [Preprint]


Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding.

Schemmel, R.; Eacock, F.; Dymel, C.; Hemsel, T.; Hunstig, M.; Brökelmann, M.; Sextro, W.

Proceedings of 52nd Int. Sympsoium in Microelectronics (IMAPS), Boston, MA, USA, October 1-3, 2019 . [Preprint]


Thermosonic wedge-wedge bonding using dosed tool heating.

Unger, A.; Hunstig, M.; Brökelmann, M.; Hesse, H. J.

Proceedings of 22nd Microelectronics and Packaging Conference (EMPC), Pisa, Italy, September 16-19, 2019 . [Preprint]

2018

Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges.

Unger, A.; Hunstig, M.; Meyer, T.; Brökelmann, M.; Sextro, W.

In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, volume Vol. 2018, No. 1, pp. 000572-000577., 2018. [Preprint] [online]


Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding.

Dymel, C.; Schemmel, R.; Hemsel, T.; Sextro, W.; Brökelmann, M.; Hunstig, M.

Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan, 2018. [Preprint] [online]

Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process.

Dymel, C.; Eichwald, P.; Schemmel, R.; Hemsel, T.; Brökelmann, M.; Hunstig, M.; Sextro, W.

Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany, 2018, 2018. [Preprint] [online]

Effects of different working frequencies on the joint formation in copper wire bonding.

Schemmel, R.; Althoff, S.; Sextro, W.; Unger, A.; Hunstig, M.; Brökelmann, M.

CIPS 2018 – 10th International Conference on Integrated Power Electronics Systems, Stuttgart/Germany, March 20-22, 2018, ETG-Fachbericht 156, VDE-Verlag, 2018, pp. 230-235. [Preprint]

Modellbasierte Schwingungsuntersuchung geklebter Chipaufbauten hinsichtlich ihrer Eignung zum Ultraschall-Drahtbonden.

Panepinto, J.; Dobs, T.; Grams, A.; Höfer, J.; Lang, K. D.; Helmich, L.; Hunstig, M.

Elektronische Baugruppen und Leiterplatten (EBL 2018): Vorträge der 9. DVS/GMM-Tagung in Fellbach am 20. und 21. Februar 2018, DVS-Berichte Band 340, DVS Media, 2018, S. 33-39. [Preprint]

2017

Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design.

Eichwald, P.; Althoff, S.; Schemmel, R.; Sextro, W.; Unger, A.; Brökelmann, M.; Hunstig, M.

IMAPS 50th Anniversary Symposium, Raleigh (NC), USA, Oct. 10-12, 2017, pp. 438-443. [Preprint] [online]

Effect of laser assistance in ultrasonic copper wire bonding.

Schneider, F.; Long, Y.; Ohrdes, H.; Twiefel, J.; Brökelmann, M.; Hunstig, M.; Venkatesh, A.; Hermsdorf, J.; Kaierle, S.; Overmeyer, L.

Lasers in Manufacturing Conference, Munich, Germany, June 26-29, 2017. [Preprint] [online]

2016

Validated Simulation of the Ultrasonic Wire Bonding Process.

Unger, A.; Schemmel, R.; Meyer, T.; Eacock, F.; Eichwald, P.; Althoff, S.; Sextro, W.; Brökelmann, M.; Hunstig, M.; Guth, K.

IEEE CPMT Symposium Japan, 2016 . [Preprint] [online]

Micro Wear Modeling in Copper Wire Wedge Bonding.

Eichwald, P.; Unger, A.; Eacock, F.; Althoff, S.; Sextro, W.; Guth, K.; Brökelmann, M.; Hunstig, M.

IEEE CPMT Symposium Japan, 2016. [Preprint] [online]

Kupferbondverbindungen intelligent herstellen.

Brökelmann, M.; Unger, A.; Meyer, T.; Althoff, S.; Sextro, W.; Hunstig, M.; Biermann, F. A.; Guth, K.

wt-online 7/8-2016, S. 512-519, 2016. [online]

Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.

Meyer, T.; Unger, A.; Althoff, S.; Sextro, W.; Brökelmann, M.; Hunstig, M.; Guth, K.

IEEE 66th Electronic Components and Technology Conference, 2016. [online]

Wear optimized consumables for copper wire bonding in industrial mass production.

Brökelmann, M.; Siepe, D.; Hunstig, M.; Guth, K.; Schnietz, M.

CIPS 2016 – 9th International Conference on Integrated Power Electronics Systems, ETG-Fachberichte, Vol. 148, pp 211-217, 204. [Preprint] [online]

2015

Modeling and Simulation of the Ultrasonic Wire Bonding Process.

Meyer, T.; Unger, A.; Althoff, S.; Sextro, W.; Brökelmann, M.; Hunstig, M.; Guth, K.

17th IEEE Electronics Packaging Technology Conference, Singapore, 2015. [online]

Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.

Unger, A.; Sextro, W.; Meyer, T.; Eichwald, P.; Althoff, S.; Eacock, F.; Brökelmann, M.; Hunstig, M.; Guth, K.

17th IEEE Electronics Packaging Technology Conference, Singapore, 2015. [online]

Copper wire bonding ready for industrial mass production.

Brökelmann, M.; Siepe, D.; Hunstig, M.; McKeown, M.; Oftebro, K.

48th IMAPS International Symposium on Microelectronics, Orlando (FL), USA, Oct. 26-29, pp. 399-405, 2015. [Preprint]

Aktive Schwingungskompensation beim Ultraschall-Drahtbonden.

Brökelmann, M.

electronic fab 4-2015, pp 40-43, 2015. [Preprint] [online] (free)

2014

Active Vibration Control in Ultrasonic Wire Bonding.

Brökelmann, M.

Bodo’s Power Systems, December 2014. [Preprint]

Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.

Unger, A.; Sextro, W.; Althoff, S.; Eichwald, P.; Meyer, T.; Eacock, F.; Brökelmann, M.; Hunstig, M.; Bolowski, D.; Guth, K.

47th IMAPS International Symposium on Microelectronics, San Diego (CA), USA, Oct. 13-16, 2014. [Preprint]

Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding.

Unger, A.; Sextro, W.; Althoff, S.; Meyer, T.; Brökelmann, M.; Neumann, K.; Reinhart, R. F.; Guth, K.; Bolowski, D.

8th International Conference on Integrated Power Electronic Systems, ETG-Fachberichte, Vol. 141, pp. 175-180, 2014. [online]

2013

Influences of bonding parameters on the tool wear for copper wire bonding.

Eichwald, P.; Sextro, W.; Althoff, S.; Eacock, F.; Schnietz, M.; Guth, K.; Brökelmann, M.

15th Electronics Packaging Technology Conference (EPTC 2013), pp. 669-672, IEEE, 2013. [online]

2012

Process integrated wire-bond quality control by means of cytokine-Formal Immune Networks.

Montealegre, N.; Hagenkötter, S.

Journal of Intelligent Manufacturing, Vol. 23(3), pp. 699-715, 2012. [online]

Active and Passive Vibration Control of Ultrasonic Bonding Transducers.

Brökelmann, M.; Neubauer, M.; Schwarzendahl, S. M.; Hesse, H.-J.; Wallaschek, J.

ACTUATOR 12 Conference Proceedings, pp. 451-454, Wirtschaftsförderung Bremen, 2012.

Optimization of Bond Transducer Vibrations Using Active and Semi-active Control.

Neubauer, M.; Brökelmann, M.; Schwarzendahl, S. M.; Hesse, H.-J., Wallaschek, J.

Proc. SPIE, Vol. 8341, Active and Passive Smart Structures and Integrated Systems, pp. 83412L, 2012. [online]

2009

Process integrated Wirebond Quality Control and its Industrial Verification.

Hagenkötter, S.; Brökelmann, M.; Hesse, H. J.

IMAPS European Microelectronics and Packaging Conference, Rimini, Italy, 2009.

2008

PiQC – a process integrated quality control for nondestructive evaluation of ultrasonic wire bonds.

Hagenkötter, S.; Brökelmann, M.; Hesse, H.-J.

IEEE Ultrasonics Symposium (IUS 2008), pp. 402-405, IEEE, 2008. [online] [Preprint]

PiQC – Sensorgestützte prozessintegrierte Qualitäts-Kontrolle beim Drahtbonden.

Hesse, H. J.; Brökelmann, M.; Hagenkötter, S.

in Lindner, K. (Ed.): DVS Jahrbuch Mikroverbindungstechnik 2008/2009, pp.108-129, 2008.

Process Integrated Quality Control for Wire Bonding.

Gilardoni, R.;Hagenkötter, S.; Brökelmann, M.

IMAPS 2008 – 41st International Symposium on Microelectronics, Rhode Island, USA, 2008.

2006

Model for Piezoelectric Actuators with Parallelogram-Kinematics.

Bistry, S.; Brökelmann, M.; Krol, R.; Wallaschek, J.

Proceedings of 2nd International Workshop on Piezoelectric Materials and Applications in Actuators (IWPMA), May 22-26, 2005, pp. 229-230, HNI-Verlagsschriftenreihe, Vol. 180, 2006.

2005

Model Based Development of an Integrated Sensor-Actuator System for Online Quality Monitoring in Ultrasonic Wire Bonding.

Brökelmann, M., Wallaschek, J., Hesse, H. J.

ASME International Mechanical Engineering Congress and Exposition, ASME Conference Proceedings, Vol. 4210X, pp. 219-226, 2005. [online]

2004

Application of Self-Sensing Characteristics of Piezoelectric Transducers in the Quality Monitoring of Ultrasonic Welding Processes.

Brökelmann, M.; Król, R.; Wallaschek, J.; Hesse, H.

Proceedings of the 5th International Conference on Vibroengineering, pp. 6-11, 2004.

A Self-Sensing Transducer for Ultrasonic Wire Bonding.

Brökelmann, M.; Król, R.; Wallaschek, J.; Hesse, H.

Proceedings of the 18th International Congress on Acoustics (ICA 2004), 4-9 April 2004, Kyoto, Japan, Vol. IV, pp. 2901-2904, 2004. [online] (free)

Bond process monitoring via self-sensing piezoelectric transducers.

Brökelmann, M.; Wallaschek, J.; Hesse, H.

Proceedings of the 2004 IEEE International Frequency Control Symposium and Exposition, pp. 125-129, 2004. [online]

2002

A Simple Transducer Model for Longitudinal Flip-Chip Bonding.

Sattel, T.; Brökelmann, M.

IEEE UFFC International Ultrasonics Symposium, October 8-11, Munich, Germany, 2002.