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Bondjet BJ931

Dual-Head Leadframe Wedge Bonder

The Bondjet BJ931 is an ultrasonic wedge bonder developed especially for maxtrix leadframe applications. The application of two bondheads enables to bond two different wire sizes as well as a combination of wire and ribbon. The fully automatic dual-head leadframe wedge bonder Bondjet BJ931 meets the latest technology and flexibility demands for automotive and power electronics applications; handling heavy aluminum, copper wire and ribbon on two specialized bondheads that can be exchanged. Your benefits:

  • Robust, clean design
  • Low maintenance requirements
  • User-friendly software
  • Service support functions
  • Industry-leading PiQC™ process monitoring system
  1. Your Benefits

    Advanced Features and Process Advantages

    • Precisely programmable bondforce actuator
    • Wear-free components with Piezo technology
    • Maintenance-free solid state joints
    • Integrated, non destructive pulltest for wire and ribbon
    • Automated bondforce calibration
    • Pattern recognition time: 6 ms – 8 ms (search region: 512 × 512 pixels, pattern: 64 × 64 pixels)
    • Rapid image capture with new digital image processing and flash light illumination
    • E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge

    Central wedge bonder control system

    • A central 23” touch panel is used to monitor and control the bonder and indexing system
    • Metal keypad and robust trackball for industrial use
    • A user-friendly calibration wizard and automatic update of calibration data at bondhead change on all available bondheads

    Interchangeable bondheads

    • The Bondjet BJ931 supports heavy wire and ribbon bondheads for aluminum, copper and AlCu
    • An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
    • Wire clamp for loop shape control is standard on all heavy wire bondheads, optionally equipped with non-destructive pulltest

    Quality

    • Continuous real time monitoring of wire deformation, transducer current and frequency within programmable control limits
    • Process integrated Quality Control PiQC: detection of further parameters by additional sensor system (e.g. friction) for 100 % quality monitoring in real time (patented); as option
    • Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % save on equipment
    • Inline pull modules for non-destructive pulltest with no influence on process time
  2. Technical Data
    • Working area: X: 100 mm, Y: 90 mm, Z: 42 mm, P: 440°
    • Mechatronic bondhead:
      • HBK (Frontcut, Backcut)
      • RBK Ribbon (Frontcut)
      • RBK Copper (Frontcut, Backcut)
        Frequency: 60 kHz*; alternative frequencies on request
    • Cutting methods: active, passive, air cut (for frontcut)
    • Wire: Al, Cu, AlCu: 50 μm – 600 μm** (2 mil – 24 mil)
    • Ribbon: Al, Cu, AlCu: 250 ìm x 25 μm up to 2000 μm x 400 μm** (Cu: 200 μm)
      (10 mil x 1 mil up to 80 mil x 16 mil)
    • Ultrasonic:
      • Digital ultrasonic generator with PLL (Phase Locked Loop),
        internal frequency resolution <1 Hz
      • Programmable ultrasonic power output
    • Footprint and weight:
      • 1550 – 1725 mm x 1273 mm x 1885 mm (W x D x H, excl. light tower)
      • Weight: approx. 1400 kg
    • Media connectivity:
      • Compressed air (high purity)
      • Vacuum
      • 16A/230V AC
      • Digital IOs
      • USB Ports
      • SMEMA connection
      • Gigabit Ethernet (TCP/IP)
      • Profibus support

    Dickdraht_BJ931

  3. Bondheads

    Heavy Wire Bondhead HBK

    • Type: HBK Frontcut and backcut
    • Transducer: 60 kHz*, alternative frequencies on request
    • Wire: Al, AlCu: 50 µm (2 mil) – 600 µm (24 mil)**
    • Precisely programmable bondforce actuator
    • Wedge: 2.5″ for 60 kHz

    Heavy Wire Bondhead RBK Ribbon

    • Type Ribbon: RBK  Froncut
    • Transducer: 60 kHz*, alternative frequencies on request
    • Wire: 250 µm x 25 µm up to 2000 µm x 400 µm** (Cu: 200 µm)
      (10 mil x 1 mil up to 80 mil x 16 mil)
    • Precisely programmable bondforce actuator
    • Wedge length: 2.622″

    Heavy Wire Bondhead RBK Copper

    • Type Copper: RBK  Froncut
    • Transducer: 60 kHz*, alternative frequencies on request
    • Wire: Cu : 50 µm – 600 µm** (2 mil – 24 mil)
    • Precisely programmable bondforce actuator
    • Wedge length: 2.622″

  4. E-Box

    Adjustment tool for wire bonders

    The E-Box of the Hesse GmbH is a patent-registered visualisation system for control supported, reproducible adjustments of bondhead elements. It includes a camera for optical displaying of wedge, cutter and wire guide as well as a graphical support for adjustment- and positioning control. E-Box allows significant time reduction for setting up the machine. Software enhanced optical adjustment system for wedge, cutter and wire guide / wire clamp.

    E-Box for Bonder – Advantages during Production

    • Better reproducibility of the adjustment depending attributes (e.g. loop forming) after change of wearing parts
    • Longer life time of wearing parts

     

    Advantages for Bond Process

    • System for reproducible set-up of wedge, cutter and wire guide / wire clamp
    • Set-up without microscope
    • Free programmable, specified positions for bondhead elements
      • shown as limitation line
      • different views selectable (different sides, bottom, front etc.)
    • Minimizes time expenditure for set-up work, set-up control and readjustment
    • Process secured adjustment of wire feed elements (wedge, wire clamp, wire guide, cutter etc.)
    • Graphical supported, visual control of:
      • wedge and wire guide position
      • distance between wedge and wire clamp
      • gap of wire clamp
      • wire pass
      • cutter respectively cutting position

    e-box_BJ931

     

     

  5. Process integrated Quality Control PiQC

    PiQC = Process integrated Quality Control

    The Hesse GmbH has implemented a new Process integrated Quality Control system (PiQC) that is unique to the global wire bonding market. A sensor integrated into the Transducer allows for the first time a multi-dimensional signal analysis of the bond process. PiQC calculates a bond quality index value in realtime, using significant signals from the wire-bonding process.

    Advantages for volume production 

    • Inspection of every bond
    • No mechanical load of the bond connection
    • Product specific configuration of the quality control system

    Feedback from the process

    • Mechanical oscillation of the wedge
    • Friction at bond surface
    • Transducer current
    • Ultrasonic frequency progression
    • Wire deformation

    Quality statements by PiQC

    • PiQC calculates a quality index for each bond based on the actual feedback signal from the process
    • The signal related components of the quality index can be displayed graphically at any time

    Teach mode for reference data

    • Detailed automatic analysis of the welding process
    • Extraction of process-specific reference data

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    piqc-bad_BJ931

     

  6. Options
    • Process integrated Quality Control PiQC: detection of further parameters by additional sensor system (e.g. friction) for 100 % quality monitoring in real time (patented)
    • Inline pull modules: up to 4 modules per bondhead for a non- destructive pulltest (up to a total of 8 per system)
    • Bondhead integrated pulltest
    • Automated bondforce calibration
    • BDE, traceability: integrated CSV-Logger or customized implementation
    • SECS/GEM: integrated standardized server connection for automati- on and communication, handling via Workbench
    • MES: interface to Manufacturing Execution Systems, integrated or customized implementation
  7. Automation / Leadframe Indexing System

    High speed leadframe indexer

    • Strip dimensions :
      100 mm – 280 mm length, 15 mm – 90 mm width,
      max. 3.0 mm down-set
    • Substrate types: SOIC, SO8, SOL8, SOT, SOT23, SC70, TO220, power-QFN, QFN, DPAK, DFN, DSO, COB, multi-lead SOP, matrix L/F, flat-boat, programmable pitch etc.
    • Index time: 100 ms for typical TO 220 device (includes clamping)
    • Magazine size: 115 mm – 285 mm length, 20 mm – 100 mm width,
      50 mm – 200 mm height

    Customized Clamping / Clamping finger

    Matrix-Leadframes

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  8. Product video

* exact range of frequencies on request **depending on application and wire 

Product-Request

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Hesse Wire Bonder?
We are looking forward to your contacting.


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Bondjet BJ931 in Operation