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Bondjet BJ855

High Speed Fully Automatic Fine Wire Bonder

(Wedge-Wedge and Ball-Wedge)

The Bondjet BJ855 is the latest generation of fully automated fine wire bonders and expands the existing product portfolio of fine wire bonders. The Bondjet BJ855 is characterized by the following features:

  • Wedge-Wedge and Ball-Wedge bondheads
  • Optimized pattern recognition (PR)
  • Software features for the growing demand of connectivity & industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, ...)
  • Hesse Assist Tools: load cell, bondtool detection, bond tool calibration without wedge gauge for operator independency

The Bondjet BJ855 meets the increasing demands of bonding and contributes to easy porting through smart functions such as the bondhead memory or the chip libraries. Typical applications are components in RF technology, COB, MCM, hybrids, optical and automotive electronics. In addition to a standard configuration, Hesse offers automation concepts individually adapted for every application. The Bondjet BJ855 defines the latest state of technological development compared to the competition and is benchmarked for:

  • The fastest bonding speed in the industry
  • The largest working area
  • The greatest axis accuracy
  1. Your benefits

    Flexibility

    • Flexible use of working area, e.g. with a number of bonding stations (manual loading or with indexers)
    • Universal software interface for indexer control
    • Maximization of throughput by automation with two or more parallel lines

    Speed

    • Up to 7 wires per second, depending on application and bondhead,
      e.g. wedge-wedge bondhead, 25 µm wire, 1 mm loop length, metallized wafer

    Quality

    • Continuous real time monitoring of wire deformation, transducer current, frequency and impedance within programmable control limits
    • Process integrated Quality Control PiQC: detection of further parameters by additional sensor system (e.g. friction) for 100 % quality monitoring in real time (patented); available as an option

    Advanced features and process advantages

    • High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
    • Optimized pattern recognition: image capture with new digital image processing and flash
    • Hesse Assist Tools (option):
      • E-Box: patented solution for optimized tool change and programmable alignment marks for wedge and wire clamp
      • Automated bondforce calibration; a load cell prevents operater error and ensures robust processes
      • Innovative bondtool detection
      • Wire spool detection
    • Automated bondtool calibration without wedge gauge
    • Loop generator for individualized loops
    • Wear-free components with Piezo technology
    • Maintenance-free solid state joints
    • Pre-setting of bondheads via EEPROM
  2. Technical data

    Working area

    • X: 305 mm (12″); Y: 410 mm (16″)
    • Z hub: 32 mm (1.26″)
    • P rotation: 440°

    Mechatronic bondhead

    • Wedge-wedge bondhead 45°, 60°
    • Wedge-wedge bondhead 90° (deep access) for ribbon or wire
    • Ball-wedge bondhead

    Wire

    • Al, Au, Ag, Cu, Pt: 12.5 µm – 75 µm** (0.5 mil – 3 mil)**

    Ribbon

    • Al, Au: 35 µm x 6 µm up to 250 µm x 25 µm**
      (1.4 mil x 0.25 mil up to 10 mil x 1 mil)**

    Fine Wire Loop Design

    • Loop generator for individualized loops
    • Loop form functions: constant wire length, constant loop height, individual loop shapes
    • Fine pitch (wedge-wedge): 40 µm inline, 25 µm staggered/dual line (depending on wire diameter and loop)

    Footprint and weight

    • 740 mm x 1484 mm x 1912 mm (29″ x 58″ x 75″) (W x D x H, excl. light tower)
    • Weight: approx. 1150 kg

    Media connectivity

    • Compressed air (high purity)
    • Vacuum
    • 16A/230V AC
    • Digital IOs
    • USB ports
    • SMEMA connection
    • Gigabit Ethernet (TCP/IP)
    • Profi bus support

  3. Bondheads

    Wedge-Wedge bondhead

    • Bondhead 45°, 60° and 90° (deep access)
    • Frequency: 100 kHz*; alternative frequencies on request
    • Wire: Al, Au, Ag, Cu, Pt: 12.5 µm – 75 µm** (0.5 mil – 3 mil)**
    • Ribbon: Al, Au: 35 µm x 6 µm up to 250 µm x 25 µm**
    • Freely programmable wire feed, tail length, tear stroke and opening gap of wire clamp
    • Precise bondforce control (static and dynamic)
    • Bondheads can be replaced in minutest

    Ball-Wedge bondhead

    • Thermosonic ball-wedge bondhead
    • Frequency: 120 kHz*
      Option: Dual-Frequency 120/60 kHz*
    • Wire: Au 17.5 µm – 50 µm (0.7 mil – 2 mil)**
    • Multi-level bonding according to Z axis stroke of 31 mm (1.22″)
    • 11/19 mm capillaries
    • Ultrasonic in preferred direction by bondhead rotation

     

  4. E-Box

    Adjustment tool for wire bonders

    The E-Box of the Hesse GmbH is a patent-registered visualisation system for control supported, reproducible adjustments of bondhead elements. It includes a camera for optical displaying of wedge, cutter and wire guide as well as a graphical support for adjustment- and positioning control. E-Box allows significant time reduction for setting up the machine. Software enhanced optical adjustment system for wedge, cutter and wire guide / wire clamp.

    E-Box for Bonder – Advantages during Production

    • Better reproducibility of the adjustment depending attributes (e.g. loop forming) after change of wearing parts
    • Longer life time of wearing parts

    Advantages for Bond Process

    • System for reproducible set-up of wedge, cutter and wire guide / wire clamp
    • Set-up without microscope
    • Free programmable, specified positions for bondhead elements
      • shown as limitation line
      • different views selectable (different sides, bottom, front etc.)
    • Minimizes time expenditure for set-up work, set-up control and readjustment
    • Process secured adjustment of wire feed elements (wedge, wire clamp, wire guide, cutter etc.)
    • Graphical supported, visual control of
      • wedge and wire guide position
      • distance between wedge and wire clamp
      • gap of wire clamp
      • wire pass
      • cutter respectively cutting position

     

  5. Process integrated Quality Control system PiQC

    PiQC = Process integrated Quality Control

    The Hesse GmbH has implemented a new Process integrated Quality Control system (PiQC) that is unique to the global wire bonding market. A sensor integrated into the Transducer allows for the first time a multi-dimensional signal analysis of the bond process. PiQC calculates a bond quality index value in realtime, using significant signals from the wire-bonding process.

    Advantages for volume production

    • Inspection of every bond
    • No mechanical load of the bond connection
    • Product specific configuration of the quality control system

    Feedback from the process

    • Mechanical oscillation of the wedge
    • Friction at bond surface
    • Transducer current
    • Ultrasonic frequency progression
    • Wire deformation

    Quality statements by PiQC

    • PiQC calculates a quality index for each bond based on the actual feedback signal from the process
    • The signal related components of the quality index can be displayed graphically at any time

    Teach mode for reference data

    • Detailed automatic analysis of the welding process
    • Extraction of process-specific reference data

    piqc_bj959_hbk10_screenshot

  6. Software Options

    Software Options

    • Hesse Bonder Network (HBN): complete line management, synchronization of data, easy integration of new machines via Plug & Produce, no server necessary
    • PBS Server & Workbench 2.0: master programming, automatic backup system, remote functions: e.g. pattern recognition, line management, quality data, status display of consumables
    • TwinCAT® Automation: integration of control software for automation in Hesse Bonder Interface
    • SECS/GEM: integrated standardized server connection for automation and communication, handling via Workbench
    • MES: interface to Manufacturing Execution Systems, integrated or customized implementation
    • CSV-Logger: storage of all machine and process data, e.g. bond positions etc.
    • Login via USB stick
    • Remote support
  7. Automation

    Automatisierung

    Automatomation BJ820 Indexer

    Automation Overview

    The precise and safe handling of the products in and out of the production machine plays a significant role in controlling the product quality, yield and efficiency of the production equipment. For this reason Hesse GmbH is offering automation concepts individually adapted for every application. The portfolio of automation components for our machines consists of the following groups:

     

    All our machines are suitable for integration into production lines. This also applies to indexers and magazine lifts, which generally communicate to neighbouring systems by SMEMA interface. The customer specific special solutions which differ from the standard, have lead to some extraordinary optional features, such as:

    • Indexer with automatic rail width adjustment
    • Indexer with tilt function for bonding 3-dimensional MID’s
    • Integrated barcode scanner for automatic program selection
    • Indexer with 2 or 3 rails for parallel AUER boat processing
    • Manual heated workholder with adjustable height for maximum flexibility
    • Magazine lifts with capacity for multiple magazines
  8. Product Video

*exact range of frequencies on request; **depending on bondhead, application, wire

Product-Request

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Hesse Wire Bonder?
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Bondjet BJ855 in Operation