RAFI Eltec is relying on the Wedge-Wedge Wire Bonder by HESSE Mechatronics
As a technology service provider RAFI Eltec GmbH develops and produces electronic assemblies and systems according to customer-specific requirements from the idea to the final product. In addition to their SMD and THT product lines, RAFI Eltec GmbH carries out fully automatic chip-on-board production in a clean room and generates many miniaturized serial products with a high level of complexity and quality for more than 20 years. Due to a continuous increase in demand, RAFI Eltec GmbH has increased its chip-on-board capacity with their latest investment in a new BJ820 model Wedge-Wedge Wire Bonder.
Preparation and evaluation had been carried out by a RAFI Eltec GmbH team consisting of employees from the Engineering Services Department, the COB Specialist Department and a process specialist from the Quality Assurance and Technology Department.
On the one hand, the BJ820 Wedge-Wedge Bonder by Hesse is impressive due to the high quality of bonds on very challenging evaluation assemblies, on which high SMD components have been assembled beforehand close to the chip. On the other hand, the aluminum wire bonder features an impressive theoretical bonding speed ranging up to 7 wires per second. In a practical trial during the evaluation phase, this system was considerably faster than competitors’ systems.
The very high level of bonding quality is also due to the wear-free and low-maintenance piezo bonding head, real-time monitoring of bonding quality (PiQC- Process-integrated Quality Control), bond-force control, as well as a solid and heavy construction, which lowers the level of vibration that occurs by effectively absorbing and dampening them.
A further advantage of this machine is the large working range, which enables an additional easily accessible manual bond site for samples or for bonding in front of the inline bonding area.
The “Hesse E-Box” facilitates and enables fitting the bond wedge via a video camera, distinctly reducing downtime due to changing tools and wire.
The already integrated handling system, which is capable to operate with the existing trays, can easily be adapted to the bonding system to ensure the loading and unloading of the pcbs.
Hesse documented the benchmark test bonding along with microscope images of the bonding sites, height profiles and dimensions of the source and destination bonds, as well as pull resistance values that were within good range at the first go.
During the evaluation phase, the BJ820 bonder by HESSE had received the highest rating in analyses of various systems made by different manufacturers within the scope of a cost-benefit analysis. Following several weeks of serial production, this positive evaluation result has been confirmed in the field of practice.
Due to this expansion of capacity, RAFI Eltec GmbH sees itself in a good position for further development within the chip-onboard field and sees this innovation as an optimum base for the production of complex electronic assemblies with high miniaturization requirements.RAFI Eltec GmbH, Martin Schlecht; Daniel Wagenbreth, Martin Zähringer