Bondjet BJ653

A Bonder for manual or automatic bonding

The Bondjet BJ653, with its changeable bond heads, serves the wire bonding processes of wedge-wedge as well as ball-wedge and can handle fine wire, heavy wire and ribbon. The operating methods from manual to automatic bonding is particularly appropriate for the use in laboratories, in the development and for suppliers for validating their product quality. BJ653 is ideal for product samples, pre-production prototypes or small volume production runs in proven and reliable Hesse quality. The Bondjet BJ653 is part of the new bonder generation and offers the same handling regarding operation and look & feel as the the fully automatic machines of Hesse. It is characterized by an open workspace, which achieves the same process result as in a fully automated production wire bonder. The Bondjet BJ653 has a lower throughput than the other Bondjets but is the avenue to fully automatic wire bonding. The available bondheads for the BJ653 are identical to the bondheads for the Hesse production machines. This enables a targeted preparation of the production process on the Bondjet BJ653.
  1. Your Benefits

    Advanced features and process advantages

    • Bondheads for all common wire materials
    • Wear-free components with piezo technology
    • Maintenance-free fl exure hinges
    • Working area: X: 100 mm (3.9″); Y: 115 mm (4.2″); Z: 42 mm (1.7″)
    • Intelligent bondhead connecting system with integrated memory storing all calibration data: bondheads are interchangeable within a few minutes
    • Optimized pattern recognition
    • Use of all common wire spools
    • Loop generator for customized loops
    • Integrated, non destructive pulltest for wire and ribbon (HBK, RBK)
    • Continuous, real time monitoring of wire deformation, transducer current and frequency within programmable control limits
    • Machine mobility by mounted rollers; as an option

  2. Technical Data

    Technical Data

    • Open working area BJ653: X: 100 mm (3.9″); Y: 115 mm (4.2″);
      Z: 42 mm (1.7″)
    • P-rotation: 440°
    • Digital ultrasonic generator with PLL (Phase Locked Loop),
      internal frequency resolution <1 Hz;
      programmable ultrasonic power output
    • Windows® Embedded operating system
    • Height of operator desk: 730 mm (29″)
    • Footprint: 700 mm x 1020 mm x 1409 mm (28″ x 32″ x 55″)
      (W x D x H, excl. monitor and light tower)
    • Weight: approx. 330 kg, depending on configuration

    Media connectivity

    • Compressed air (high purity)/nitrogen
    • Vacuum
    • 100 -240V 50Hz/60Hz
    • USB ports
    • Gigabit Ethernet (TCP/IP)


    • Stereo microscope with adapter arm, magnification from 6.5- to 40- times in 5 steps, incl. lighting
    • Camera microscope (in preparation)
    • E-Box Lite: Inspection camera (in preparation)

  3. Bondheads

    Heavy Wire Wedge-Wedge Bondheads

    • Heavy wire and ribbon bondheads for aluminum, copper and AlCu:
      • HBK (Frontcut, Backcut)
      • RBK Ribbon (Frontcut)
      • RBK Copper (Frontcut, Backcut)
    • Frequency: 60 kHz*; alternative frequencies available on request
    • Wire Al, Cu, AlCu: 50 µm – 600 µm (2 mil – 24 mil)**
    • Ribbon Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm
      (Cu: 200 µm) (10 mil x 1 mil up to 80 mil x 16 mil)**
    • Cutting methods:
      • Active Cutting: repeatable, precise, programmable cutting depth
      • Air Cut: No impact on surface, e.g. for highly sensitive chips because of „touch-free“ cutting
      • Passive Cutting
    • Integrated, non destructive pulltest
    • Process integrated Quality Control PiQC: detection of further parameters by additional sensor system (e.g. friction) for 100 % quality monitoring in real time (patented); available as an option

    Heavy Wire Loop Design

    • Reproducible loop geometrics by wire guide appropriate for the material (e.g. pulling wire buff er)
    • Loop form functions: constant wire length, constant loop height, individual loop shapes
    • Mechanically demanding loop geometrics by parameterization and individual wire clamp application

    Fine Wire Wedge-Wedge Bondheads

    • Bondhead 45° and 90° (deep access)
    • Frequency: 100 kHz*; alternative frequencies available on request
    • Wire Al, Au: 12.5 µm – 75 µm (0.5 mil – 3 mil)**
      Cu: 17.5 µm – 50 µm (0.7 mil – 2 mil)**
    • Ribbon: Al, Au: 35 µm x 6 µm up to 250 µm x 25 µm
      (1.4 mil x 0.25 mil up to 10 mil x 1 mil)**
    • High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
    • Precise bondforce control (static and dynamic)
    • Process integrated Quality Control PiQC: detection of further parameters by additional sensor system (e.g. friction) for 100 % quality monitoring in real time (patented); available as an option

    Fine Wire Wedge-Wedge Loop Design

    • Loop form functions: constant wire length, constant loop height, individual loop shapes
    • Fine pitch: 40 µm in-line, 25 µm staggered/dual-line (depending on wire and loop)
    • Freely programmable wire feed, tail length, tear stroke and opening gap of wire clamp

    Ball-Wedge Bondhead (in preparation)

    • Thermosonic ball-wedge bondhead
    • Frequency: 120 kHz*
      Option: Dual-Frequency 120/60 kHz*
    • Wire: Au 17.5 µm – 50 µm (0.7 mil – 2 mil)**

  4. E-Box Lite

    Adjustment tool for wire bonders

    E-Box Lite: Portable USB inspection camera (in preparation)

  5. Process integrated Quality Control system PiQC

    PiQC = Process integrated Quality Control

    The Hesse GmbH has implemented a new Process integrated Quality Control system (PiQC) that is unique to the global wire bonding market. A sensor integrated into the Transducer allows for the first time a multi-dimensional signal analysis of the bond process. PiQC calculates a bond quality index value in realtime, using significant signals from the wire-bonding process.

    Advantages for volume production

    • Inspection of every bond
    • No mechanical load of the bond connection
    • Product specific configuration of the quality control system

    Feedback from the process

    • Mechanical oscillation of the wedge
    • Friction at bond surface
    • Transducer current
    • Ultrasonic frequency progression
    • Wire deformation

    Quality statements by PiQC

    • PiQC calculates a quality index for each bond based on the actual feedback signal from the process
    • The signal related components of the quality index can be displayed graphically at any time

    Teach mode for reference data

    • Detailed automatic analysis of the welding process
    • Extraction of process-specific reference data



* exact range of frequencies on request **depending on application and wire


Would you like more information about 
Hesse Wire Bonder?
We are looking forward to your contacting.


Trade Shows

We hope to see you at one
of the next trade shows.


Bondjet BJ653 in Operation