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The Bonding Experts

Welcome to Hesse GmbH

 

 

Hesse GmbH develops and manufactures ultrasonic wire bonders for all wire dimensions as well as ultrasonic flipchip bonders in combination with standardized or customized automation solutions.

 

 Bondjet BJ820 Bondjet BJ935/BJ939
 Flipjet FJ520
Hesse GmbH Fine Wire Wedge Bonder BJ820
 
Hesse GmbH Heavy Wire Wedge Bonder BJ93X
 
Hesse GmbH Ultrasonic Flipchip Bonder FJ520
 Fine Wire Bonder
  Heavy Wire Bonder Flipchip Bonder

  

Bondjet BJ931
Hesse GmbH Dual-Head Wedge Bonder BJ931
Dual-Head Wedge Bonder


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