Welcome to Hesse GmbH
Hesse GmbH develops and manufactures ultrasonic wire bonders for all wire dimensions as well as ultrasonic flipchip bonders in combination with standardized or customized automation solutions.
| Bondjet BJ820 | Bondjet BJ935/BJ939 | Flipjet FJ520 | ||
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| Fine Wire Bonder | Heavy Wire Bonder | Flipchip Bonder |
| Bondjet BJ931 |
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| Dual-Head Wedge Bonder |
