Welcome to Hesse GmbH

Besides Fine and Heavy Wire Bonders and Ultrasonic Flipchip-Bonders the Hesse GmbH develops and manufactures standard and custom solutions for Automation.

• Dual-Head Wedge Bonder

• Fine Wire Wedge Bonder
• Ribbon Bonder
• Deep Access Bonder
• Heavy Wire Bonder
• Ultrasonic Flipchip-Bonder

New Dual-Head Wedge Bonder

Bondjet BJ820		Bondjet BJ935/BJ939		Flipjet FJ520
Fine Wire Bonder		Heavy Wire Bonder		Flipchip Bonder

New Dual-Head Wedge Bonder Makes Americas Debut

Hesse Mechatronics Launches Heavy Wire and Ribbon Bonding Services for Early Stage Product Development

Hesse Mechatronics, Inc. Appoints Senior Business Development Manager

SEMICON West 2013

SEMICON Taiwan 2013

8th Annual MEPTEC Medical Electronics Symposium

More Tradeshows

DIN EN ISO 9001:2008

 certified