Welcome to Hesse GmbH

Besides Fine and Heavy Wire Bonders and Ultrasonic Flipchip-Bonders the Hesse GmbH develops and manufactures standard and custom solutions for Automation.

• Dual-Head Wedge Bonder

• Fine Wire Wedge Bonder
• Ribbon Bonder
• Deep Access Bonder
• Heavy Wire Bonder
• Ultrasonic Flipchip-Bonder

New Dual-Head Wedge Bonder

Bondjet BJ820		Bondjet BJ935/BJ939		Flipjet FJ520
Fine Wire Bonder		Heavy Wire Bonder		Flipchip Bonder

Hesse Mechatronics Launches Heavy Wire and Ribbon Bonding Services for Early Stage Product Development

Hesse Mechatronics, Inc. Appoints Senior Business Development Manager

Hesse Mechatronics to Demonstrate High Speed Fully Automatic Dual Head Wedge Bonder at SEMICON China 2013

ECTC 2013

IMS 2013

SEMICON West 2013

More Tradeshows

DIN EN ISO 9001:2008

 certified