SEMICON CHINA 2023 - Hesse GmbH

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  - Bondjet LSB959
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Company
Applications & Markets
Customer Solutions
Products
- Fine Wire Bonding
- Heavy Wire Bonding
- Thermosonic Wire Bonding
  - Bondjet LSB959
- Ultrasonic Welding
  - Smart Welder SW1085
- Special Features
  - Software
  - E-Box
  - PiQC
- Automation
News & Events
Contact
- Sales
- Service

SEMICON CHINA 2023
June 29^th – July 1^st2023

Booth T2321
Shanghai New International Expo Centre

Hesse GmbH Headquarters

Hesse GmbH
Lise-Meitner-Str. 5
D-33104 Paderborn

+49 5251 1560-0
+49 5251 1560-290

info@hesse-mechatronics.com

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