Lasersonic Wire Bonder LSB959

Lasersonic Wire Bonder LSB959

Fully Automatic Heavy Wire Bonder with Thermosonic Function

The Heavy Wire Bonder LSB959 is a wire bonder of the latest generation with the capability of adding thermal energy to the welding process. The laser applied for the heating of the bond tool enables a precise temperature control at the tip of the bond tool. Therefore, this platform offers the first possibility of a termosonic-heavy wire-process.

Beneficial effects of heated bondtool for the process:

  • Increased weldability:
    Especially for materials and processes which are challenging by “cold” ultrasonic bonding
  • Only local heating:
    Least influence on the periphery
  • Reduced ultrasonic power and normal force:
    Less power and/or less force reduces mechanical stress and avoid damage of sensitive substrates (e.g. dies)
  • Increased total system capacity:
    processing of heavy wire without increasing space or cross section
  • Improved yield
  • Increased shear forces
  • Reduced process time
  • Precisely controlled process

Lasersonic Wire Bonder LSB959 processes fully automatic a wide range of large-sized substrates, chips and other materials. The systems can be used as a fully automatic machine or operated manually. Outstanding features are high speed and the large bonding area. In addition to a standard configuration, Hesse offers automation concepts individually adapted for every application.

Advanced features and process advantages

  • Full integration of tool temperature in the process parameters and bonding programms
  • All features of a Heavy Wire Bonder BJ959 with same footprint
    • Improved wire guidance: short distance between bondhead and spool
    • Optimized pattern recognition
    • Automated bondtool change without wedge gauge
    • Precisely programmable bondforce actuator
    • Loop generator for individual loops
    • Maintenance-free solid state joints
    • Pre-setting of bondheads via EEPROM
    • Hesse Assist Tools (option): :
      • E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
      • Automated bondforce calibration; a load cell prevents operator error and ensures robust processes
      • Innovative bondtool detection
      • Wire spool detection

Flexibility

  • Working area
    • LSB959: 370 mm x 560 mm
  • Flexible use of the large working area, e.g. vacuum clamping of several 5″ x 7″ standard DCBs by vacuum workholder sixfold
  • Maximization of throughput by automation (two/more parallel lanes
  • Safe operation: Laser class 1
  • Two processes on one plattform: classic ultrasonic heavy wire bonding and thermosonic heavy wire bonding

Quality

  • Continuous real time monitoring of wire deformation, transducer current, and frequency, bond tool temperature within programmable control limits
  • Process integrated Quality Control PiQC: detection of further parameters, e.g. friction behavior, by additional sensor system for 100 % quality monitoring in real time (patented); as option
    Integrated, non-destructive pulltest
    Remote pull function on PiQC threshold value for optimized cycle time; > 99% savings in quality check compared with single NDPT (non destructive pull test)

Thermosonic-Function

LSB-bondhead-6

  • Heavy wire bondhead with thermosonic function
  • Laser-heated bondtool tip with controlled laser absorption
  • Fast local heat transport into wire and substrate
  • Temperature: Bondtool tip at 400-500 °C for interface at 150-200 °C
  • No thermal effects on transducer
  • Accurate laser setting due to pilot laser
  • Inert gas noozle (e.g. nitrogen) prevents Cu oxidation during bonding process (option)
  • Precisely controlled bondtool temperature
  • Intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in minutes
  • Wire clamp for loop shape control is standard on all bondheads; optionally equipped with non destructive pulltest

Working area

LSB-bondhead-7

  • LSB959: X: 370 mm; Y: 560 mm; Z: 42 mm
  • P-rotation: 440°

Thermsonic bondhead

  • LSK (Backcut): Laser-heated bondtool tip with controlled laser
    absorption
  • Temperature: Bondtool tip at 400-500 °C for interface at 150-200 °C
  • Frequency: 60 kHz*; alternative frequencies on request

Cutting methods

  • active, passive

Wire

  • Cu: 300 μm – 500 μm**

Ultrasonic

  • Digital ultrasonic generator with PLL (Phase Locked Loop),
    internal frequency resolution <1 Hz
  • Programmable ultrasonic power output

Laser

  • IR fiber laser with power up to 130W
  • Programmable temperature output

Footprint and weight

  • LSB959: 805 mm x 1634 mm x 1912 mm, approx. 1300 kg

Various loop form functions

  • Reproducible loop geometry by wire guide appropriate for the material involved and moving wire buffer
  • Constant wire length and loop height
  • Mechanically demanding loop geometrics by parameterization and individual wire clamp application
  • Individual loop shapes by configurable loop trajectory generator

* exact range of frequencies on request

** other sizes on request