Lasersonic Wire Bonder LSB959

Lasersonic Wire Bonder LSB959

Fully Automatic Lasersonic Bonder

Lasersonic Wire Bonders LSB959 are the new generation of heavy wire wedge-wedge bonders with additional thermal energy directly addressed to the bondtool.
The laser-heated bondtool enables a precisely controlled temperature at the tool tip by laser energy.

Beneficial effects of heated bondtool for the process:

  • Increased bondability
    especially for materials which are not well processible by “cold” ultrasonic bonding like battery caps, copper alloys, coated caps/clips, etc.
    No additional surface heating for other applications.
  • Reduced ultrasonic power and normal force
    reduced power and/or force lower mechanical stress and avoid damage of sensitive substrates (e.g. dies)
  • Increased total system capacity
    processing of larger wire/ribbon/clips without increasing space or cross section
  • Improved yield
  • Increased shear forces
  • Reduced process time
  • Precisely controlled process

The Lasersonic Wire Bonders are developed for the fully automated processing of a wide range of large-sized substrates, chips and other materials. The systems can be used as a fully automatic machine or operated manually. Outstanding features are high speed and the large bonding area. In addition to a standard configuration, Hesse offers automation concepts individually adapted for every application.

Advanced features and process advantages

  • Vmproved wire handling: short distance between bondhead and spool
  • Optimized pattern recognition: image capture with new digital image processing and flash
  • Bondtool installation using calibrated height fixture
  • Precisely programmable bondforce actuator
  • Loop generator for individual loops
  • Maintenance-free solid state joints
  • Pre-setting of bondheads via EEPROM
  • Hesse Assist Tools (option):
    • E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
    • Automated bondforce calibration; a load cell prevents operator error and ensures robust processes
    • Innovative bondtool detection
    • Wire spool detection


  • Working area
    • LSB959: 370 mm x 560 mm
  • Flexible use of the large working area, e.g. vacuum clamping of several 5″ x 7″ standard DCBs
  • Maximization of throughput by automation (two/more parallel lanes


  • Continuous real time monitoring of wire deformation, transducer current, and frequency within programmable control limits
  • Process integrated Quality Control (PiQC): detection of further parameters, e.g. friction behavior, by additional sensor system for 100 % quality monitoring in real time (patented); as option
  • Integrated, non-destructive pulltest
  • Remote pull function on PiQC threshold value for optimized cycle time; > 99% savings in quality check compared with single NDPT (non destructive pull test)

Lasersonic bondhead

  • Lasersonic heavy wire bondhead for copper wire
  • Laser-heated bondtool tip with controlled laser absorption
  • Fast heat transport into wire and substrate
  • Temperature: Bondtool tip at 400-500 °C for interface at 150-200 °C
  • No thermal effects on transducer
  • Accurate laser setting due to pilot laser
  • Inert gas noozle (e.g. nitrogen) prevents Cu oxidation during bonding process (option)
  • Precisely controlled bondtool temperature
  • An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
  • Wire clamp for loop shape control is standard on all bondheads; optionally equipped with non destructive pulltest

Working area

  • LSB959: X: 370 mm; Y: 560 mm; Z: 42 mm
  • P-rotation: 440°

Lasersonic bondhead

  • LSK (Backcut): Laser-heated bondtool tip with controlled laser
  • Temperature: Bondtool tip at 400-500 °C for interface at 150-200 °C
  • Frequency: 60 kHz*; alternative frequencies on request

Cutting methods

  • active, passive


  • Digital ultrasonic generator with PLL (Phase Locked Loop),
    internal frequency resolution <1 Hz
  • Programmable ultrasonic power output


  • IR fiber laser with power up to 130W
  • Programmable temperature output

Footprint and weight

  • LSB959: 805 mm x 1634 mm x 1912 mm, ca. 1300 kg

Various loop form functions

  • Reproducible loop geometry by wire guide appropriate for the material involved and moving wire buffer
  • Constant wire length and loop height
  • Mechanically demanding loop geometrics by parameterization and individual wire clamp application
  • Individual loop shapes by configurable loop trajectory generator

*exact range of frequencies on request