Benefits and Features
Advanced features and process advantages
Telescopic table for manual Loading
- 50 μm – 600 μm** bondhead for Al, Cu, AlCu (2 mil – 24 mil)
- Improved wire handling: short distance between bondhead and spool
- Optimized pattern recognition: image capture with new digital image processing and flash
- Hesse Assist Tools (option):
- E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
- Automated bondforce calibration; a load cell prevents operating error and ensures robust processes
- Innovative bondtool detection
- Wire spool detection
- Automated bondtool calibration without wedge gauge
- Precisely programmable bondforce actuator
- Loop generator for individual loops
- Wear-free components with Piezo technology
- Maintenance-free solid state joints
- Pre-setting of bondheads via EEPROM
Flexibility
- Working area:
BJ985: 370 mm x 870 mm - Flexible use of the large working area, e.g. vacuum clamping of several 5″ x 7″ standard DCBs
- Maximization of throughput by automation (two/more parallel lanes
Quality
Heavy Wire Bondhead
- Continuous real time monitoring of wire deformation, transducer current and frequency within programmable control limits
- Process integrated Quality Control PiQC: detection of further parameters by additional sensor system (e.g. friction) for 100 % quality monitoring in real time (patented); as option
- Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % save on equipment
- Integrated, non destructive pulltest for wire and ribbon
Heavy wire bondheads
- Heavy wire and ribbon bondheads for Al, Cu and AlCu
- An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
- Wire clamp for loop shape control is standard on all bondheads; optionally equipped with non destructive pulltest
Technical Data
Working area
- BJ985: X: 370 mm; Y: 870 mm; Z: 42 mm
- P-rotation: 440°
Mechatronic bondhead
- HBK (Frontcut, Backcut); frequency: 60 kHz*
- RBK Ribbon (Frontcut); frequency: 57 kHz*
- RBK Copper (Frontcut, Backcut); frequency: 57 kHz*
alternative frequencies available on request
Cutting methods
- active, passive, air cut (for frontcut)
Wire
- Al, Cu, AlCu: 50 μm – 600 μm** (2 mil – 24 mil)
Ribbon
- Al, Cu, AlCu: 250 μm x 25 μm bis 2000 μm x 400 μm** (Cu: 200 μm)
(10 mil x 1 mil up to 80 mil x 16 mil)
Ultrasonic
- Digital ultrasonic generator with PLL (Phase Locked Loop),
internal frequency resolution <1 Hz - Programmable ultrasonic power output
Small footprint – high performance
- 880 mm x 1780 mm x 1912 mm (W x D x H, excl. monitor and light tower), appr. 1800 kg
* exact range of frequencies on request
**depending on application and wire
Video