Process Support / Service / Development & Consulting
What technological challenges does your process offer and what are the technical features and characteristics to meet your customers’ expectations?
We support you in developing and implementing your individual process requirements. Our range of services includes:
Design Validation Builds
Small Series Production
Request Process Support / Service / Development & Consulting
Testimonial from Fast Semiconductor Packaging
“Hesse Mechatronics provided the technical and equipment support to upgrade our BJ820 aluminum wedge bonder to meet our customers Chip on Board gold and ribbon wire high frequency applications.
We now support both a 45 and 90 degree bond head options for speed critical and deep access bonding applications.”
Richard Moore, General Manager, FAST Semiconductor Packaging, www.fastsemi.com
Testimonial from Virginia Tech Center
“Hesse Mechatronics helps us meet our power module fabrication needs. Their professional wire bonding services are fast and reliable.”
Wenli Zhang, Research Assistant Professor / Packaging Lab Manager at Virginia Tech Center for Power Electronics Systems