Hesse Wire Bonder

Wire Bonder for all Wire Sizes & Applications!

Fully automated wedge wedge and ball wedge bonder – more than 20 years of experience


  • Single and Dual Head Machines for Fine Wire, Heavy Wire & Ribbon Bonding
  • Wear-free components with Piezo-Technology
  • Handling heavy wires from 50 µm up to 600 µm with only one bondhead
  • Handling fine wire (e.g. gold wire bonding) from 12,5 µm up to 75 µm
  • Working Area for Small and Large-Sized Substrates (Battery, Solar Application)
  • HF / RF Technology, COB, MCM, Hybrids, Opto and Automotive Electronics, Chip Bonding
  • Standardized or Customized Automation Solutions
  • 100% quality monitoring in real-time
  • Operator Independency due to New Machine Features (Hesse Assist Tools)
  • Software Features for the Growing Demand of Connectivity and Industry 4.0 / IoT
  • Worldwide Service, Process Support & Trainings

Find the suitable Wire Bonder for Your Application!

+49 5251 1560-0

Send us your Requirements – we come up with the Best Solution!


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