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Bondjet BJ985

Fully Automatic Heavy Wire Wedge Bonder with a large working area

Bondjet BJ985 belongs to the new generation of ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips, automotive applications (e.g. batteries) and other materials.  It can be used as a fully automatic machine or operated manually. Hesse offers the only available solution on the market of handling wires from 50 µm up to 600 µm** with only one bondhead. Bondjet BJ985 is characterized by several new features:
  • Optimized pattern recognition (PR)
  • Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, ...)
  • Hesse Assist Tools: load cell, bondtool and wire spool detection, tool calibration without wedge gauge for operator independency
  Outstanding features of the new Bondjet BJ985 are the large bonding area of 370 mm x 870 mm, a high drive through and high speed. Hesse GmbH, as technology leader, has designed the only heavy wire bondhead with a non destructive pulltest and a unique transducer integrated sensor for 100 % quality monitoring in real time. A bondhead change from aluminium to copper can be realized within minutes. In addition to a standard configuration Hesse offers automation concepts individually adapted for every application.
  1. Your Benefits

    Advanced features and process advantages

    • 50 µm – 600 µm** bondhead for Al, Cu, AlCu (2 mil – 24 mil)
    • Improved wire handling: short distance between bondhead and spool
    • Optimized pattern recognition: image capture with new digital image processing and flash
    • Hesse Assist Tools (option):
      • E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
      • Automated bondforce calibration; a load cell prevents operating error and ensures robust processes
      • Innovative bondtool detection
      • Wire spool detection
    • Automated bondtool calibration without wedge gauge
    • Precisely programmable bondforce actuator
    • Loop generator for individualized loops
    • Wear-free components with Piezo technology
    • Maintenance-free solid state joints
    • Pre-setting of bondheads via EEPROM

    Flexibility:

    • Working area BJ985: 370 mm x 870 mm (14.6″ x 34.3″)
    • Flexible use of the large working area, e.g. vacuum clamping of several 5″ x 7″ standard DCBs
    • Maximization of throughput by automation (two/more parallel lanes)

    Quality

    • Continuous, real time monitoring of wire deformation, transducer current and frequency within programmable control limits
    • Process integrated Quality Control PiQC: detection of further parameters by additional sensor system (e.g. friction) for 100 % quality monitoring in real time (patented); as option
    • Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % save on equipment
    • Integrated, non destructive pulltest for wire and ribbon

     Heavy wire bondheads

    • Heavy wire and ribbon bondheads for Al, Cu and AlCu
    • An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
    • Wire clamp for loop shape control is standard on all bondheads; optionally equipped with non destructive pulltest

    Various loop form functions

    • Reproducible loop geometry by wire guide appropriate for the material involved and moving wire buffer
    • Constant wire length and loop height
    • Mechanically demanding loop geometrics by parameterization and individual wire clamp application
    • Individual loop shapes by configurable loop trajectory generator
  2. Technical data

    Working area

    • BJ985: X: 370 mm (14.6″); Y: 870 mm (34.3″); Z: 42 mm (1.65″); Z-stroke: 64 mm (2.52″)
    • P-rotation: 440°

    Cutting methods

    • active, passive, air cut (for frontcut)

    Wire

    • Al, Cu, AlCu : 50 µm – 600 µm** (2 mil – 24 mil)

    Ribbon

    • Al, Cu, AlCu: 250 µm x 25 µm bis 2000 µm x 400 µm** (Cu: 200 µm) (10 mil x 1 mil up to 80 mil x 16 mil)

    Ultrasonic

    • Digital ultrasonic generator with PLL (Phase Locked Loop), internal frequency resolution <1 Hz
    • Programmable ultrasonic power output

    Small footprint – high performance

    • 880 mm x 1780 mm x 1912 mm (W x D x H, excl. monitor and light tower), appr. 1800 kg

    Media connectivity

    • Compressed air (high purity)
    • Vacuum
    • 16A AC
    • Digital IOs
    • USB Ports
    • SMEMA connection
    • Gigabit Ethernet (TCP/IP)
    • Profibus support

  3. Bondheads

    Mechatronic bondhead

    • HBK (Frontcut, Backcut)
    • RBK Ribbon (Frontcut)
    • RBK Copper (Frontcut, Backcut)

    Frequency: 60 kHz*; alternative frequencies available on request

     

  4. E-Box

    Adjustment tool for wire bonders

    The E-Box of the Hesse GmbH is a patent-registered visualisation system for control supported, reproducible adjustments of bondhead elements. It includes a camera for optical displaying of wedge, cutter and wire guide as well as a graphical support for adjustment- and positioning control. E-Box allows significant time reduction for setting up the machine. Software enhanced optical adjustment system for wedge, cutter and wire guide / wire clamp.

    E-Box for Bonder – Advantages during Production

    • Better reproducibility of the adjustment depending attributes (e.g. loop forming) after change of wearing parts
    • Longer life time of wearing parts

    Advantages for Bond Process

    • System for reproducible set-up of wedge, cutter and wire guide / wire clamp
    • Set-up without microscope
    • Free programmable, specified positions for bondhead elements
      • shown as limitation line
      • different views selectable (different sides, bottom, front etc.)
    • Minimizes time expenditure for set-up work, set-up control and readjustment
    • Process secured adjustment of wire feed elements (wedge, wire clamp, wire guide, cutter etc.)
    • Graphical supported, visual control of
      • wedge and wire guide position
      • distance between wedge and wire clamp
      • gap of wire clamp
      • wire pass
      • cutter respectively cutting position

    Heavy Wire Bondhead HBK10 in front of E-Box

  5. Process integrated Quality Control system PiQC

    PiQC = Process integrated Quality Control

    The Hesse GmbH has implemented a new Process integrated Quality Control system (PiQC) that is unique to the global wire bonding market. A sensor integrated into the Transducer allows for the first time a multi-dimensional signal analysis of the bond process. PiQC calculates a bond quality index value in realtime, using significant signals from the wire-bonding process.

    Advantages for volume production

    • Inspection of every bond
    • No mechanical load of the bond connection
    • Product specific configuration of the quality control system

    Feedback from the process

    • Mechanical oscillation of the wedge
    • Friction at bond surface
    • Transducer current
    • Ultrasonic frequency progression
    • Wire deformation

    Quality statements by PiQC

    • PiQC calculates a quality index for each bond based on the actual feedback signal from the process
    • The signal related components of the quality index can be displayed graphically at any time

    Teach mode for reference data

    • Detailed automatic analysis of the welding process
    • Extraction of process-specific reference data

    piqc_bj959_hbk10_screenshot

  6. Software Options

    Software Options

    • Hesse Bonder Network (HBN): complete line management, synchronization of data, easy integration of new machines via
      Plug & Produce, no server necessary
    • PBS Server & Workbench 2.0: central data management, line management, automatic backup system, remote pattern recognition
    • TwinCAT® Automation: integration of control software for automation in Hesse Bonder Interface
    • SECS/GEM: integrated, standardized server connection for automation and communication, handling via Workbench
    • MES: interface to Manufacturing Execution Systems, integrated or customized implementation
    • CSV Logger: storage of all machine and process data, e.g. bond positions etc.
    • Login via USB stick
  7. Automation

    Automation

    The precise and safe handling of the products in and out of the production machine plays a significant role in controlling the product quality, yield and efficiency of the production equipment. For this reason Hesse GmbH is offering automation concepts individually adapted for every application. The portfolio of automation components for our machines consists of the following groups:

     

    All our machines are suitable for integration into production lines. This also applies to indexers and magazine lifts, which generally communicate to neighbouring systems by SMEMA interface. The customer specific special solutions which differ from the standard, have lead to some extraordinary optional features, such as:

    • Indexer with automatic rail width adjustment
    • Indexer with tilt function for bonding 3-dimensional MID’s
    • Integrated barcode scanner for automatic program selection
    • Indexer with 2 or 3 rails for parallel AUER boat processing
    • Manual heated workholder with adjustable height for maximum flexibility
    • Magazine lifts with capacity for multiple magazines

    Automatomation_BJ820_Indexer_2

  8. Product video

* exact range of frequencies on request **depending on application and wire

Product-Request

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Hesse Wire Bonder?
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Bondjet BJ985 in Operation