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Scientific Publications

We continuously work to improve existing and develop new packaging and interconnection technologies and machines for the efficient and reliable industrial application of these technologies. Several results of this research have been published in the past years:
Dymel, C.; Schemmel, R.; Hemsel, T.; Sextro, W.; Brökelmann, M.; Hunstig, M. Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding.
Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany, 2018, 2018. [Preprint]
Dymel, C.; Eichwald, P.; Schemmel, R.; Hemsel, T.; Brökelmann, M.; Hunstig, M.; Sextro, W. Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process.
Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany, 2018, 2018. [Preprint]
Schemmel, R.; Althoff, S.; Sextro, W.; Unger, A.; Hunstig, M.; Brökelmann, M. Effects of different working frequencies on the joint formation in copper wire bonding
CIPS 2018 – 10th International Conference on Integrated Power Electronics Systems, Stuttgart/Germany, March 20-22, 2018, ETG-Fachbericht 156, VDE-Verlag, 2018, pp. 230-235 [Preprint]
Panepinto, J.; Dobs, T.; Grams, A.; Höfer, J.; Lang, K. D.; Helmich, L.; Hunstig, M. Modellbasierte Schwingungsuntersuchung geklebter Chipaufbauten hinsichtlich ihrer Eignung zum Ultraschall-Drahtbonden.
Elektronische Baugruppen und Leiterplatten (EBL 2018): Vorträge der 9. DVS/GMM-Tagung in Fellbach am 20. und 21. Februar 2018, DVS-Berichte Band 340, DVS Media, 2018, S. 33-39 [Preprint]
Eichwald, P.; Althoff, S.; Schemmel, R.; Sextro, W.; Unger, A.; Brökelmann, M.; Hunstig, M. Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
IMAPS 50th Anniversary Symposium, Raleigh (NC), USA, Oct. 10-12, 2017, pp. 438-443 [Preprint]
Unger, A.; Schemmel, R.; Meyer, T.; Eacock, F.; Eichwald, P.; Althoff, S.; Sextro, W.; Brökelmann, M.; Hunstig, M.; Guth, K. Validated Simulation of the Ultrasonic Wire Bonding Process.
IEEE CPMT Symposium Japan, 2016 [online] [Preprint]
Eichwald, P.; Unger, A.; Eacock, F.; Althoff, S.; Sextro, W.; Guth, K.; Brökelmann, M.; Hunstig, M. Micro Wear Modeling in Copper Wire Wedge Bonding.
IEEE CPMT Symposium Japan, 2016 [online] [Preprint]
Brökelmann, M.; Unger, A.; Meyer, T.; Althoff, S.; Sextro, W.; Hunstig, M.; Biermann, F. A.; Guth, K. Kupferbondverbindungen intelligent herstellen. wt-online 7/8-2016, S. 512-519, 2016 [online]
Meyer, T.; Unger, A.; Althoff, S.; Sextro, W.; Brökelmann, M.; Hunstig, M.; Guth, K. Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. IEEE 66th Electronic Components and Technology Conference, 2016 [online]
Brökelmann, M.; Siepe, D.; Hunstig, M.; Guth, K.; Schnietz, M. Wear optimized consumables for copper wire bonding in industrial mass production. CIPS 2016 – 9th International Conference on Integrated Power Electronics Systems, ETG-Fachberichte, Vol. 148, pp 211-217, 204 [pdf]
Meyer, T.; Unger, A.; Althoff, S.; Sextro, W.; Brökelmann, M.; Hunstig, M.; Guth, K. Modeling and Simulation of the Ultrasonic Wire Bonding Process. 17th IEEE Electronics Packaging Technology Conference, Singapore, 2015 [online]
Unger, A.; Sextro, W.; Meyer, T.; Eichwald, P.; Althoff, S.; Eacock, F.; Brökelmann, M.; Hunstig, M.; Guth, K. Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear. 17th IEEE Electronics Packaging Technology Conference, Singapore, 2015 [online]
Brökelmann, M.; Siepe, D.; Hunstig, M.; McKeown, M.; Oftebro, K. Copper wire bonding ready for industrial mass production48th IMAPS International Symposium on Microelectronics, Orlando (FL), USA, Oct. 26-29, pp. 399-405, 2015 [pre-print]
Brökelmann, M. Aktive Schwingungskompensation beim Ultraschall-Drahtbonden. electronic fab 4-2015, pp 40-43, 2015 [online (free)] [pre-print]
Brökelmann, M. Active Vibration Control in Ultrasonic Wire Bonding. Bodo’s Power Systems, December 2014 [pre-print]
Unger, A.; Sextro, W.; Althoff, S.; Eichwald, P.; Meyer, T.; Eacock, F.; Brökelmann, M.; Hunstig, M.; Bolowski, D.; Guth, K. Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds47th IMAPS International Symposium on Microelectronics, San Diego (CA), USA, Oct. 13-16, 2014 [pdf]
Unger, A.; Sextro, W.; Althoff, S.; Meyer, T.; Brökelmann, M.; Neumann, K.; Reinhart, R. F.; Guth, K.; Bolowski, D. Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding.
8th International Conference on Integrated Power Electronic Systems, ETG-Fachberichte, Vol. 141, pp. 175-180, 2014 [online]
Eichwald, P.; Sextro, W.; Althoff, S.; Eacock, F.; Schnietz, M.; Guth, K.; Brökelmann, M. Influences of bonding parameters on the tool wear for copper wire bonding. 15th Electronics Packaging Technology Conference (EPTC 2013), pp. 669-672, IEEE, 2013 [online]
Montealegre, N.; Hagenkötter, S. Process integrated wire-bond quality control by means of cytokine-Formal Immune Networks. Journal of Intelligent Manufacturing, Vol. 23(3), pp. 699-715, 2012 [online]
Hagenkötter, S.; Brökelmann, M.; Hesse, H. J. Process integrated Wirebond Quality Control and its Industrial Verification. IMAPS European Microeletronics and Packaging Conference, Rimini, Italy, 2009
Hagenkötter, S.; Brökelmann, M.; Hesse, H.-J. PiQC – a process integrated quality control for nondestructive evaluation of ultrasonic wire bonds. IEEE Ultrasonics Symposium (IUS 2008), pp. 402-405, IEEE, 2008 [online]
Hesse, H. J.; Brökelmann, M.; Hagenkötter, S. PiQC – Sensorgestützte prozessintegrierte Qualitäts-Kontrolle beim Drahtbonden, in Lindner, K. (Ed.): DVS Jahrbuch Mikroverbindungstechnik 2008/2009, pp.108-129, 2008
Gilardoni, R.;Hagenkötter, S.; Brökelmann, M Process Integrated Quality Control for Wire Bonding. IMAPS 2008 – 41st International Symposium on Microelectronics, Rhode Island, USA, 2008
Bistry, S.; Brökelmann, M.; Krol, R.; Wallaschek, J. Model for Piezoelectric Actuators with Parallelogram-Kinematics. Proceedings of 2nd International Workshop on Piezoelectric Materials and Applications in Actuators (IWPMA), May 22-26, 2005, pp. 229-230, HNI-Verlagsschriftenreihe, Vol. 180, 2006
Brökelmann, M., Wallaschek, J., Hesse, H. J. Model Based Development of an Integrated Sensor-Actuator System for Online Quality Monitoring in Ultrasonic Wire BondingASME International Mechanical Engineering Congress and Exposition, ASME Conference Proceedings, Vol. 4210X, pp. 219-226, 2005 [online]
Brökelmann, M.; Król, R.; Wallaschek, J.; Hesse, H. Application of Self-Sensing Characteristics of Piezoelectric Transducers in the Quality Monitoring of Ultrasonic Welding Processes. Proceedings of the 5th International Conference on Vibroengineering, pp. 6-11, 2004
Brökelmann, M.; Król, R.; Wallaschek, J.; Hesse, H. A Self-Sensing Transducer for Ultrasonic Wire Bonding. Proceedings of the 18th International Congress on Acoustics (ICA 2004), 4-9 April 2004, Kyoto, Japan, Vol. IV, pp. 2901-2904, 2004 [online (free)]
Brökelmann, M.; Wallaschek, J.; Hesse, H. Bond process monitoring via self-sensing piezoelectric transducers. Proceedings of the 2004 IEEE International Frequency Control Symposium and Exposition, pp. 125-129, 2004 [online]
Sattel, T.; Brökelmann, M. A Simple Transducer Model for Longitudinal Flip-Chip Bonding. IEEE UFFC International Ultrasonics Symposium, October 8-11, Munich, Germany, 2002