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fine wire bonder Bondjet BJ820

Bondjet BJ820

High Speed Fully Automatic Fine Wire Wedge Bonder

The Bondjet BJ820 is world‘s leading fully automated fine wire wedge wedge bonder. The BJ820 is ready for all wire bonding challenges on a single platform, using wires and ribbons made of aluminium, copper and gold. Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics. The BJ820 defines the latest state of technological development compared to the competition and is benchmark for:

  • The highest bonding speed in the industry
  • The largest working area
  • The greatest axis accuracy
  1. Your Benefits

    Advanced features and process advantages

    • High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
    • Precise bondforce control (static and dynamic)
    • E-Box: patented solution for optimized tool change and programmable alignment marks for wedge and wire clamp
    • Wear-free components with Piezo technology
    • Maintenance-free solid state joints


    • Largest working area: 305 mm x 410 mm (12″ x 16″)
    • Flexible use of working area, e.g. with a number of bonding stations (manual loading or with indexers)
    • Universal software interface for indexer control
    • Maximization of throughput by automation with two or more parallel lines


    • Up to 7 wires per second, application-dependent, e.g. with 25 µm wire, 1 mm loop length, metallized wafer

    working area fine wire bonder BJ820

    fine wire bondhead 45°fine wire bondhead 90°

    BJ820 Mikroscopemachine types


    • Continuous real time monitoring of wire deformation, transducer current, frequency and impedance within programmable control limits
    • Process integrated Quality Control PiQC: detection of further parameters by additional sensor system (e.g. friction) for 100 % quality monitoring in real time (patented); available as an option
    • PBS200 – server for central data management, for up to 20 Hesse wire bonders
    • BDE, traceability – in PBS200 integrated XML interface or customized implementation
    • SECS/GEM: integrated standardized server connection for automation and communication, handling via Workbench
    • MES: interface to Manufacturing Execution Systems, integrated or customized implementation

    Piezo bondheads

    • Bondhead 45°, 60° and 90° (deep access)
    • Freely programmable wire feed, tail length, tear stroke and opening gap of wire clamp
    • Low maintenance costs
    • Precise bondforce control (static and dynamic)
    • Bondheads can be replaced in minutes
  2. Technical Data

    Working area

    • X: 305 mm (12″); Y: 410 mm (16″)
    • Z hub: 30 mm (1.2″)
    • P rotation: 420°°

    Mechatronic bondhead

    • Bondhead 45°, 60°
    • Bondhead 90° (deep access) for ribbon or wire

    Frequency: 100 kHz*; alternative frequencies on request


    • Al, Au, Ag, Cu, Pt: 12.5 µm – 75 µm** (0.5 mil – 3 mil)**


    • Al, Au: 35 µm x 6 µm up to 250 µm x 25 µm**
      (1.4 mil x 0.25 mil up to 10 mil x 1 mil)**

    Fine wire wedge-wedge loop design

    • Loop length: 70 µm up to 20 mm (2.8 mil – 800 mil), depending on wire diameter
    • Various loop form functions
      • Constant wire length
      • Constant loop height
      • Individual loop shapes
    • Fine pitch 40 µm inline, 25 µm staggered/dual line
      (depending on wire and loop)

    Machine dimensions

    • Footprint: 722 mm x 1250 mm x 1800 mm (28.4″ x 49.2″ x 70.9″) (W x D x H, excl. monitor and light tower)
    • Weight: approx. 1250 kg

    Media connection

    • Compressed air (high purity)
    • Vacuum
    • 16A/230V AC
    • Digital IOs
    • USB ports
    • SMEMA connection
    • Profibus support

    fine wire bonder Bondjet BJ820


  3. Bondheads

    Fine Wire Bondhead

    • Type: BK Bondhead 45°
      Option: BK Bondhead 60°
    • Frequency: 100 kHz*; alternative frequencies on request
    • Wire: Al, Au: 17.5 µm – 50 µm (0.7 mil – 2.0 mil)
      Optional (after consultation): 12.5 µm – 75 µm (0.5 mil – 3.0 mil)
      Cu (in development): 50 µm (2mil)
    • Speed: Up to 7 wires per second, depending on:
      • wire length
      • wire size
      • looping
      • bondhead design (for 45° head only)
    • Bonding force: 5 cN – 150 cN programmable
    • Wedge length: 1″ (for all frequencies)


    fine wire bondhead 45°


    • Wear-free and low maintenance components with PIEZO-Technology
    • Free programmable tail length, tear stroke and opening gap of wire clamp
    • High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
    • Precise bondforce control (static and dynamic)
    • High mechanical stiffness of suspension helps eliminate undesired vibrations


    Fine Wire Bondhead Deep Access 90°

    • Type: DA Bondhead 90° (Deep Access)
    • Frequency: 100 kHz*; alternative frequencies on request
    • Wire: Al, Au: 17.5 µm – 50 µm (0.7 mil – 2.0 mil)
      Optional (after consultation): 12.5 µm – 75 µm (0.5 mil – 3.0 mil)
      Cu: 17.5 µm – 30 µm (0.7 mil – 1.2 mil)
      Ribbon: Al, Au: 6 µm x 35 µm (0.25 mil x 1.4 mil) µp to 25 µm x 250 µm (1 mil x 10 mil)
    • Wedge length: 1″ (for all frequencies), >1″ on request
    • Immersion depth: 14 mm diving depth for bonding inside packages with 1″ wedge tool; optional 18 mm with 1.3″ wedge tool


    fine wire bondhead 90°


    • Deep access version for bonding ribbon and packages with access limitations
    • Wear free and low maintenance components with PIEZO-Technology
    • Free programmable tail length, tear stroke and opening gap of wire clamp
    • Additional clamp above the transducer for optimized clamping force control
    • High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
    • Precise bondforce control (static and dynamic)
    • Compact design reduces weight and moment of inertia allowing higher accelerations
    • High mechanical stiffness of suspension helps eliminate undesired vibrations
  4. E-Box

    Adjustment tool for wire bonders

    The E-Box of the Hesse GmbH is a patent-registered visualisation system for control supported, reproducible adjustments of bondhead elements. It includes a camera for optical displaying of wedge, cutter and wire guide as well as a graphical support for adjustment- and positioning control. E-Box allows significant time reduction for setting up the machine. Software enhanced optical adjustment system for wedge, cutter and wire guide / wire clamp.

    E-Box for Bonder – Advantages during Production

    • Better reproducibility of the adjustment depending attributes (e.g. loop forming) after change of wearing parts
    • Longer life time of wearing parts


    Advantages for Bond Process

    • System for reproducible set-up of wedge, cutter and wire guide / wire clamp
    • Set-up without microscope
    • Free programmable, specified positions for bondhead elements
      • shown as limitation line
      • different views selectable (different sides, bottom, front etc.)
    • Minimizes time expenditure for set-up work, set-up control and readjustment
    • Process secured adjustment of wire feed elements (wedge, wire clamp, wire guide, cutter etc.)
    • Graphical supported, visual control of
      • wedge and wire guide position
      • distance between wedge and wire clamp
      • gap of wire clamp
      • wire pass
      • cutter respectively cutting position

    Bondhead in e-box

    screen e-box

    bondhead in e-box


  5. Process integrated Quality Control system PiQC

    PiQC = Process integrated Quality Control

    The Hesse GmbH has implemented a new Process integrated Quality Control system (PiQC) that is unique to the global wire bonding market. A sensor integrated into the Transducer allows for the first time a multi-dimensional signal analysis of the bond process. PiQC calculates a bond quality index value in realtime, using significant signals from the wire-bonding process.

    Advantages for volume production

    • Inspection of every bond
    • No mechanical load of the bond connection
    • Product specific configuration of the quality control system

    Feedback from the process

    • Mechanical oscillation of the wedge
    • Friction at bond surface
    • Transducer current
    • Ultrasonic frequency progression
    • Wire deformation

    Quality statements by PiQC

    • PiQC calculates a quality index for each bond based on the actual feedback signal from the process
    • The signal related components of the quality index can be displayed graphically at any time

    Teach mode for reference data

    • Detailed automatic analysis of the welding process
    • Extraction of process-specific reference data

    good piqc screen

    bad piqc screen

  6. PBS200 – Wire Bonder Server

    PBS200 – Wire Bonder Server

    The PBS200 Wire Bonder Server is a Windows based system to connect up to 20 Hesse Mechatronics wire bonders at your factory. You can supervise and administrate the machines while production is running. With PBS200 you will have perfect integration of your wire bonders in the production system.
    The wire bonders communicate with PBS200 Server over the powerful XML based PBS network protocol.

    PBS System

    Features of PBS200

    • „„Backup all the data of all connected wire bonders
    • User Administration and assignment of user accounts to wire bonders or production lines
    • Process Data in real time, ability to store the process data you need and import in Microsoft Excel (Option)
    • Masterprogramming
    • Customization
      PBS200 can be enhanced according to specific customer requirements for traceability or an MES Server connection (Option). Allow the MES system to decide, what process program is used, store the process results in your MES system. Implement your rework strategy on the Wire Bonders
    • SECS/GEM – compliant module is available for PBS200 (Option)
    • Multi Server: Run multiple PBS200 Servers and administrate all with the PBS Workbench in your office

    PBS200 includes

    • PBS200 Client license for one wire bonder
    • PBS200 Hardware with Windows 7 Professional™ and 2 network adaptors
    • PBS200 Server license for one server
    • PBS & PiQC Workbench with USB stick license key

    Available Process Data

    • Logbook Data
    • Machine Configuration
    • Important Program Parameters
    • Device ID and Bond Position
    • PiQC Quality Values
    • Deformation and Current Charts
    • Material and Tool Counters
    • Statistical Data
  7. Automation

    Automation OverviewAutomation BJ820 Indexer

    The precise and safe handling of the products in and out of the production machine plays a significant role in controlling the product quality, yield and efficiency of the production equipment. For this reason Hesse GmbH is offering automation concepts individually adapted for every application. The portfolio of automation components for our machines consists of the following groups:


    All our machines are suitable for integration into production lines. This also applies to indexers and magazine lifts, which generally communicate to neighbouring systems by SMEMA interface. The customer specific special solutions which differ from the standard, have lead to some extraordinary optional features, such as:

    • Indexer with automatic rail width adjustment
    • Indexer with tilt function for bonding 3-dimensional MID’s
    • Integrated barcode scanner for automatic program selection
    • Indexer with 2 or 3 rails for parallel AUER boat processing
    • Manual heated workholder with adjustable height for maximum flexibility
    • Magazine lifts with capacity for multiple magazines
  8. Product video

* exact range of frequencies on request

** depending on bondhead, application, wire



Would you like more information about 
Hesse Wire Bonder?
We are looking forward to your contacting.


Trade Shows

We hope to see you at one
of the next trade shows.


Bondjet BJ820 in Operation