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Award: “Best Innovation Award 2019” by Infineon

Hesse GmbH was awarded with the “Best Innovation Award” by Infineon on November 26, 2019 during the Global Supplier Day 2019. With this innovation prize, Infineon honors the successful, technical-scientific cooperation with Hesse Mechatronics. The ceremony took place in Kuala Lumpur, Malaysia during the evening event of GSD2019. CPO Ms. van der Burg handed the […]

Wire Bonding Batteries for Formula1 EV Race Car

Purdue University, School of Mechanical EngineeringThe newly uploaded video on www.wirebonddemo.com shows the wire bonding of the Purdue Electric Racing (PER) Batteries with a Hesse Mechatronics BJ959 Heavy Wire Bonder.The Formula1 EV Race Car of the Purdue University will race July, 2017 in Nebraska at the SAE event. More Infos: Purdue University, School of Mechanical EngineeringPurdue Electric Racing Homepage

Wire bonding for EV batteries and inverters:

Published online in “Charged – Electric Vehicles Magazine“; Issue June 2017Author: Mike McKeown, Sr. Business Development Manager at Hesse Mechatronics All electronic devices need to be connected electrically (and mechanically) and there are numerous ways of completing this task. Wire bonding is one type of interconnection. There are three types of wire bonding: thermocompression, thermosonic and […]

Wire Bonding Innovation: Plug & Produce

Published in: SMT Insight / Issue 1 – 2017 / FebruaryAuthor: Sebastian Holtkämper, Product Management, Hesse GmbH The evolving grade of automation in the semi-conductor business is fostering both the increasing robustness of processes and the reduction of its cost. These two drivers are a recognized customer wish. The term “Plug & Produce” is the […]

Hesse in CHARGED: Electric Vehicles Magazine: “A closer look at wire bonding”

Hesse Mechatronics mentioned in “Charged: Electric Vehicles Magazine”, March/April 2016 A closer look at wire bonding (by Christian Ruoff) Prior to writing his article addressing the future of battery bonding, author Christian Ruoff talked  to wire bonding experts of Hesse Mechatronics (Mike McKeown, Dr. Michael Brökelmann, Dr. Matthias Hunstig, Dr. Dirk Siepe) about Wire bonding technology […]

RAFI Eltec is relying on the Wedge-Wedge Wire Bonder by HESSE Mechatronics

As a technology service provider RAFI Eltec GmbH develops and produces electronic assemblies and systems according to customer-specific requirements from the idea to the final product. In addition to their SMD and THT product lines, RAFI Eltec GmbH carries out fully automatic chip-on-board production in a clean room and generates many miniaturized serial products with […]