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Wissenschaftliche Veröffentlichungen

Wir forschen und arbeiten kontinuierlich an der (Weiter-)Entwicklung bestehender und neuer Verfahren der Aufbau- und Verbindungstechnik und an Maschinen für den effizienten und zuverlässigen industriellen Einsatz dieser Verfahren. Aus dieser Arbeit sind in den vergangenen Jahren zahlreiche Veröffentlichungen entstanden:

 

Unger, A.; Schemmel, R.; Meyer, T.; Eacock, F.; Eichwald, P.; Althoff, S.; Sextro, W.; Brökelmann, M.; Hunstig, M.; Guth, K.Validated Simulation of the Ultrasonic Wire Bonding Process.
IEEE CPMT Symposium Japan, 2016 [online] [Preprint]
Eichwald, P.; Unger, A.; Eacock, F.; Althoff, S.; Sextro, W.; Guth, K.; Brökelmann, M.; Hunstig, M.Micro Wear Modeling in Copper Wire Wedge Bonding.
IEEE CPMT Symposium Japan, 2016 [online] [Preprint]
Brökelmann, M.; Unger, A.; Meyer, T.; Althoff, S.; Sextro, W.; Hunstig, M.; Biermann, F. A.; Guth, K.Kupferbondverbindungen intelligent herstellen. wt-online 7/8-2016, S. 512-519, 2016 [online]
Meyer, T.; Unger, A.; Althoff, S.; Sextro, W.; Brökelmann, M.; Hunstig, M.; Guth, K.Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. IEEE 66th Electronic Components and Technology Conference, 2016 [online]
Brökelmann, M.; Siepe, D.; Hunstig, M.; Guth, K.; Schnietz, M.Wear optimized consumables for copper wire bonding in industrial mass production. CIPS 2016 – 9th International Conference on Integrated Power Electronics Systems, ETG-Fachberichte, Vol. 148, pp 211-217, 204 [pdf]
Meyer, T.; Unger, A.; Althoff, S.; Sextro, W.; Brökelmann, M.; Hunstig, M.; Guth, K.Modeling and Simulation of the Ultrasonic Wire Bonding Process. 17th IEEE Electronics Packaging Technology Conference, Singapore, 2015 [online]
Unger, A.; Sextro, W.; Meyer, T.; Eichwald, P.; Althoff, S.; Eacock, F.; Brökelmann, M.; Hunstig, M.; Guth, K.Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear. 17th IEEE Electronics Packaging Technology Conference, Singapore, 2015 [online]
Brökelmann, M.; Siepe, D.; Hunstig, M.; McKeown, M.; Oftebro, K.Copper wire bonding ready for industrial mass production48th IMAPS International Symposium on Microelectronics, Orlando (FL), USA, Oct. 26-29, pp. 399-405, 2015 [pre-print]
Brökelmann, M.Aktive Schwingungskompensation beim Ultraschall-Drahtbonden. electronic fab 4-2015, pp 40-43, 2015 [online (free)] [pre-print]
Brökelmann, M.Active Vibration Control in Ultrasonic Wire Bonding. Bodo’s Power Systems, December 2014 [online (free)]
Unger, A.; Sextro, W.; Althoff, S.; Eichwald, P.; Meyer, T.; Eacock, F.; Brökelmann, M.; Hunstig, M.; Bolowski, D.; Guth, K.Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds47th IMAPS International Symposium on Microelectronics, San Diego (CA), USA, Oct. 13-16, 2014 [pdf]
Unger, A.; Sextro, W.; Althoff, S.; Meyer, T.; Brökelmann, M.; Neumann, K.; Reinhart, R. F.; Guth, K.; Bolowski, D.Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding8th International Conference on Integrated Power Electronic Systems, ETG-Fachberichte, Vol. 141, pp. 175-180, 2014 [online]
Eichwald, P.; Sextro, W.; Althoff, S.; Eacock, F.; Schnietz, M.; Guth, K.; Brökelmann, M.Influences of bonding parameters on the tool wear for copper wire bonding,
15th Electronics Packaging Technology Conference (EPTC 2013), pp. 669-672, IEEE, 2013 [online]
Montealegre, N.; Hagenkötter, S.Process integrated wire-bond quality control by means of cytokine-Formal Immune Networks. Journal of Intelligent Manufacturing, Vol. 23(3), pp. 699-715, 2012 [online]
Brökelmann, M.; Neubauer, M.; Schwarzendahl, S. M.; Hesse, H.-J.; Wallaschek, J.Active and Passive Vibration Control of Ultrasonic Bonding Transducers. ACTUATOR 12 Conference Proceedings, pp. 451-454, Wirtschaftsförderung Bremen, 2012
Neubauer, M.; Brökelmann, M.; Schwarzendahl, S. M.; Hesse, H.-J., Wallaschek, J.Optimization of Bond Transducer Vibrations Using Active and Semi-active Control. Proc. SPIE, Vol. 8341, Active and Passive Smart Structures and Integrated Systems, pp. 83412L, 2012 [online]
Hagenkötter, S.; Brökelmann, M.; Hesse, H. J.Process integrated Wirebond Quality Control and its Industrial Verification. IMAPS European Microelectronics and Packaging Conference, Rimini, Italy, 2009
Hagenkötter, S.; Brökelmann, M.; Hesse, H.-J.PiQC – a process integrated quality control for nondestructive evaluation of ultrasonic wire bonds. IEEE Ultrasonics Symposium (IUS 2008), pp. 402-405, IEEE, 2008 [online]
Hesse, H. J.; Brökelmann, M.; Hagenkötter, S.PiQC – Sensorgestützte prozessintegrierte Qualitäts-Kontrolle beim Drahtbonden, in Lindner, K. (Ed.): DVS Jahrbuch Mikroverbindungstechnik 2008/2009, pp.108-129, 2008
Gilardoni, R.;Hagenkötter, S.; Brökelmann, MProcess Integrated Quality Control for Wire Bonding. IMAPS 2008 – 41st International Symposium on Microelectronics, Rhode Island, USA, 2008
Bistry, S.; Brökelmann, M.; Krol, R.; Wallaschek, J.Model for Piezoelectric Actuators with Parallelogram-Kinematics. Proceedings of 2nd International Workshop on Piezoelectric Materials and Applications in Actuators (IWPMA), May 22-26, 2005, pp. 229-230, HNI-Verlagsschriftenreihe, Vol. 180, 2006
Brökelmann, M., Wallaschek, J., Hesse, H. J.Model Based Development of an Integrated Sensor-Actuator System for Online Quality Monitoring in Ultrasonic Wire BondingASME International Mechanical Engineering Congress and Exposition, ASME Conference Proceedings, Vol. 4210X, pp. 219-226, 2005 [online]
Brökelmann, M.; Król, R.; Wallaschek, J.; Hesse, H.Application of Self-Sensing Characteristics of Piezoelectric Transducers in the Quality Monitoring of Ultrasonic Welding Processes. Proceedings of the 5th International Conference on Vibroengineering, pp. 6-11, 2004
Brökelmann, M.; Król, R.; Wallaschek, J.; Hesse, H.A Self-Sensing Transducer for Ultrasonic Wire Bonding. Proceedings of the 18th International Congress on Acoustics (ICA 2004), 4-9 April 2004, Kyoto, Japan, Vol. IV, pp. 2901-2904, 2004 [online (free)]
Brökelmann, M.; Wallaschek, J.; Hesse, H.Bond process monitoring via self-sensing piezoelectric transducers. Proceedings of the 2004 IEEE International Frequency Control Symposium and Exposition, pp. 125-129, 2004 [online]
Sattel, T.; Brökelmann, M.A Simple Transducer Model for Longitudinal Flip-Chip Bonding. IEEE UFFC International Ultrasonics Symposium, October 8-11, Munich, Germany, 2002